Heat transfer for power modules

Abstract

In one general aspect, an apparatus can include a first module including a first semiconductor die, and a first heatsink coupled to the first module where the first heatsink includes a substrate and a first plurality of protrusions. The apparatus can also include a second module including a second semiconductor die, and a second heatsink coupled to the second module and including a second plurality of protrusions. The apparatus can also include a cover defining a channel where the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink are disposed within the channel.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a first module including a first semiconductor die;   a first heatsink coupled to the first module, the first heatsink including a substrate, and a first plurality of protrusions;   a second module including a second semiconductor die;   a second heatsink coupled to the second module and including a second plurality of protrusions; and   a cover defining a channel, the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink being disposed within the channel.   
     
     
         2 . The apparatus of  claim 1 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel. 
     
     
         3 . The apparatus of  claim 1 , wherein the cover is a first cover, the channel is a first channel, the first cover and the first heatsink are on a first side of the first module,
 the apparatus, further comprising:   a third heatsink coupled to a second side of the first module; and   a second cover including a second channel, the third heatsink being disposed within the second channel.   
     
     
         4 . The apparatus of  claim 3 , wherein the first cover is coupled to the second cover via a coupling mechanism disposed lateral to the first module. 
     
     
         5 . The apparatus of  claim 1 , wherein the first heatsink and the second heatsink are aligned along the channel. 
     
     
         6 . The apparatus of  claim 1 , wherein the first plurality of protrusions including at least one protrusion having an end separated from an inner surface of the cover by a gap. 
     
     
         7 . The apparatus of  claim 1 , wherein the first plurality of protrusions including at least one protrusion having an end in contact with an inner surface of the cover. 
     
     
         8 . The apparatus of  claim 1 , wherein the cover has a portion in contact with the first heatsink. 
     
     
         9 . The apparatus of  claim 1 , further comprising a sealing mechanism in contact with the substrate of the first heatsink. 
     
     
         10 . The apparatus of  claim 9 , wherein the first module is aligned along a first plane, the sealing mechanism is aligned along a second plane, the sealing mechanism is disposed along a perimeter of the first module. 
     
     
         11 . The apparatus of  claim 1 , further comprising:
 a coupling mechanism coupling the cover to the substrate of the first heatsink.   
     
     
         12 . The apparatus of  claim 1 , wherein the first heatsink includes a first metal and a second metal. 
     
     
         13 . The apparatus of  claim 1 , wherein the first module is a dual-sided module including a direct bonded metal substrate. 
     
     
         14 . The apparatus of  claim 1 , wherein the first module includes a direct bonded metal substrate in contact with the first semiconductor die, the direct bonded metal substrate includes a dielectric layer disposed between a pair of metal layers. 
     
     
         15 . The apparatus of  claim 1 , wherein the substrate is a first substrate, the first substrate is disposed in a first side of the first plurality of protrusions, the first heatsink further includes a second substrate disposed on a second side of the first plurality of protrusions. 
     
     
         16 . An apparatus, comprising:
 a first module including a first semiconductor die;   a second module including a second semiconductor die; and   a cover including:
 a channel in fluid communication with an outside surface of the first module and an outside surface of the second module, and 
 a plurality of protrusions extending from an inner surface of the cover into the channel. 
   
     
     
         17 . The apparatus of  claim 16 , wherein an end of at least one of the plurality of protrusions is separated from a surface of the first module by a gap. 
     
     
         18 . The apparatus of  claim 16 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel. 
     
     
         19 . The apparatus of  claim 16 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel, the first module and the second module are aligned along the channel between the inlet opening and the outlet opening. 
     
     
         20 . An apparatus, comprising:
 a first module including a first semiconductor die;   a first heatsink coupled to the first module;   a second module including a second semiconductor die;   a second heatsink coupled to the second module; and   a cover defining a channel and coupled to the first module and the second module such that the first heatsink and the second heatsink are disposed in the channel.   
     
     
         21 . The apparatus of  claim 20 , wherein the cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the channel.