Inventor · disambiguated record
Dukyong Lee
Also filed as: LEE DUKYONG
5 granted patents·4 pending applications·8 citations·filing 2017–2024
72Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC9
Top patents by PatentIndex Score
9 records- 0186US10665525B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 26, 2020·6 cites·21 claims
- 0278US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0377US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
- 0471US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
- 0567US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
- 0666US2023230895A1Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0763US11610832B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 21, 2023·0 cites·23 claims
- 0856US2025279340A1Multi-chip semiconductor module with balanced switchingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0953US2024304596A1Sintering film frames and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →