Inventor · disambiguated record
Roveendra Paul
Also filed as: PAUL ROVEENDRA
4 granted patents·4 pending applications·8 citations·filing 2011–2023
66Inventor score
Top patents by PatentIndex Score
8 records- 0186US10665525B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted May 26, 2020·6 cites·21 claims
- 0267US12471204B2Semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 11, 2025·0 cites·21 claims
- 0366US2023230895A1Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0463US11610832B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 21, 2023·0 cites·23 claims
- 0563US8461645B2Power semiconductor deviceOTREMBA RALF·Filed 2011·Granted Jun 11, 2013·2 cites·23 claims
- 0656US2024128197A1Assemblies with embedded semiconductor device modules and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0756US2025038066A1Integration of semiconductor device assemblies with thermal dissipation mechanismsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0853US2024064944A1Sealing method for direct liquid cooled power electronics packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →