Inventor · disambiguated record
Jeonghyuk Park
Also filed as: Park Jeonghyuk
10 granted patents·7 pending applications·5 citations·filing 2016–2025
81Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC11SAMSUNG DISPLAY CO LTD2VUNO INC2OSTENDO TECHNOLOGIES INC1TMAXTIBERO CO LTD1
Top patents by PatentIndex Score
17 records- 0180US11652030B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·1 cites·18 claims
- 0276US2025125227A1Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0375US12211771B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
- 0475US2025273646A1Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0574US12300689B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·18 claims
- 0672US11538963B1III-V light emitting device having low Si—H bonding dielectric layers for improved P-side contact performanceOSTENDO TECHNOLOGIES INC·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 0771US10333101B2Display apparatus and manufacturing method thereof including developing sealing member by curing molten sealing member patternSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Jun 25, 2019·2 cites·11 claims
- 0870USD1095474SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Granted Sep 30, 2025·0 cites·1 claims
- 0965US11658171B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 23, 2023·0 cites·16 claims
- 1062US2025372465A1Temperature sensing within an electronic componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1162US2025273322A1Medical image analysis method based on deep learningVUNO INC·Filed 2022·Application pending·0 cites
- 1259US2025372494A1Compact semiconductor packaging using a leadless discrete componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1355US2024128140A1Power module package having mirrored leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1453US10770679B2Display apparatus and manufacturing method thereof inlcuding substrate having guide mark disposed overlapping sealing memberSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·8 claims
- 1547US12353352B2Method for implementing re-instantiation for databaseTMAXTIBERO CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·6 claims
- 1647US2022237780A1Method for detecting serial section of medical imageVUNO INC·Filed 2022·Application pending·0 cites
- 1742USD1098055SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 14, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →