Inventor · disambiguated record
Keunhyuk Lee
Also filed as: LEE KEUNHYUK
23 granted patents·18 pending applications·21 citations·filing 2005–2025
92Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC37FAIRCHILD KR SEMICONDUCTOR LTD1LEE JOOSANG1LEE KEUNHYUK1SEMICONDUCTOR COMPONENTS IND1
Top patents by PatentIndex Score
41 records- 0191US11615967B2Power module package and method of manufacturing the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 0288US10566713B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 18, 2020·5 cites·18 claims
- 0380US11652030B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·1 cites·18 claims
- 0479US8890310B2Power module package having excellent heat sink emission capability and method for manufacturing the sameLEE KEUNHYUK·Filed 2010·Granted Nov 18, 2014·9 cites·9 claims
- 0579US2025336759A1Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0677US12489080B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Dec 2, 2025·0 cites·23 claims
- 0776US12354930B2Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·16 claims
- 0876US10741480B2Leadframe with sockets for solderless pinsSEMICONDUCTOR COMPONENTS IND·Filed 2018·Granted Aug 11, 2020·2 cites·16 claims
- 0976US2025125227A1Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1075US12211771B2Power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 28, 2025·0 cites·13 claims
- 1175US2025273646A1Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1274US12300689B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·18 claims
- 1374US2024413148A1Isolated 3d semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1472US12266590B2Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1570USD1095474SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Granted Sep 30, 2025·0 cites·1 claims
- 1670US2025233050A1Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1767US12119576B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 15, 2024·0 cites·20 claims
- 1867US11222832B2Power semiconductor device packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 11, 2022·1 cites·21 claims
- 1966US12074160B2Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 2066US11908826B2Flexible clip with aligner structureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 2166US10804626B2Press-fit power module and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 13, 2020·0 cites·20 claims
- 2265US11776871B2Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 3, 2023·0 cites·19 claims
- 2365US11658171B2Dual cool power module with stress buffer layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 23, 2023·0 cites·16 claims
- 2464US11315856B2Leadframe with sockets for solderless pinsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 2563US11004698B2Power module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 11, 2021·1 cites·18 claims
- 2662US2025372465A1Temperature sensing within an electronic componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2759US2025372494A1Compact semiconductor packaging using a leadless discrete componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2857US2025329627A1Semiconductor device package and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2956US2025279340A1Multi-chip semiconductor module with balanced switchingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 3055US2024128140A1Power module package having mirrored leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3154US2024304529A1Discrete dual pads for a circuitSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3254US2024312855A1Full ag sinter discrete premium packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3354US2025132231A1Slotted clips for reduction of molding compound delaminationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3452US10553517B2High power module semiconductor package with multiple submodulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 4, 2020·0 cites·17 claims
- 3552US2024021487A1Semiconductor device packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3651US11127651B2High power module semiconductor package with multiple submodulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 21, 2021·0 cites·17 claims
- 3751US2025157893A1Discrete semiconductor device package with lead frame clipSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3849US2010013070A1Power module package having excellent heat sink emission capability and method for manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Application pending·0 cites
- 3942USD1098055SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 14, 2025·0 cites·1 claims
- 4041US2021159157A1Semiconductor clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
- 4141US2006056213A1Power module package having excellent heat sink emission capability and method for manufacturing the sameLEE JOOSANG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →