Inventor · disambiguated record
Chin-Cheng Kuo
Also filed as: KUO CHIN-CHENG
35 granted patents·5 pending applications·156 citations·filing 2003–2024
95Inventor score
Files withINNOLUX CORP17ADVANCED SEMICONDUCTOR ENG10TAIWAN SEMICONDUCTOR MFG CO LTD9LITE ON TECHNOLOGY CORP2KUO CHIN-CHENG1
Top patents by PatentIndex Score
40 records- 0197US10976607B2Electronic deviceINNOLUX CORP·Filed 2019·Granted Apr 13, 2021·35 cites·7 claims
- 0294US8601416B2Method of circuit design yield analysisKUO CHIN-CHENG·Filed 2012·Granted Dec 3, 2013·52 cites·22 claims
- 0388US8707230B1Method and system for semiconductor simulationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 22, 2014·11 cites·20 claims
- 0486US9753895B2Method for process variation analysis of an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·6 cites·19 claims
- 0585US12235543B2Electronic deviceINNOLUX CORP·Filed 2024·Granted Feb 25, 2025·0 cites·12 claims
- 0685US11314914B2Method and non-transitory computer readable medium of operating an electronic design automation platform for an optimal intgrated circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·3 cites·20 claims
- 0785US7089434B2Wireless signal receiving device with prompt wake-up functionLITE ON TECHNOLOGY CORP·Filed 2003·Granted Aug 8, 2006·39 cites·16 claims
- 0883US12309931B2Electronic deviceINNOLUX CORP·Filed 2023·Granted May 20, 2025·0 cites·15 claims
- 0979US12147119B2Electronic deviceINNOLUX CORP·Filed 2022·Granted Nov 19, 2024·0 cites·6 claims
- 1079US2024394456A1Method for integrated circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1177US10169507B2Variation-aware circuit simulationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
- 1277US2022334435A1Electronic deviceINNOLUX CORP·Filed 2022·Application pending·0 cites
- 1376US10083257B2Method, system and computer program product for generating simulation sampleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 25, 2018·4 cites·20 claims
- 1476US9711473B1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 18, 2017·2 cites·19 claims
- 1574US11442311B2Electronic deviceINNOLUX CORP·Filed 2021·Granted Sep 13, 2022·0 cites·14 claims
- 1673US12373626B2Method and non-transitory computer readable mediumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1773US11409162B2Electronic deviceINNOLUX CORP·Filed 2021·Granted Aug 9, 2022·0 cites·14 claims
- 1872US12204839B2Method for integrated circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1972US11889627B2Display deviceINNOLUX CORP·Filed 2021·Granted Jan 30, 2024·0 cites·14 claims
- 2067US11784110B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 10, 2023·0 cites·6 claims
- 2167US10795200B2Display deviceINNOLUX CORP·Filed 2019·Granted Oct 6, 2020·0 cites·18 claims
- 2266US10999931B2Manufacturing method of a display deviceINNOLUX CORP·Filed 2019·Granted May 4, 2021·0 cites·1 claims
- 2363US10234715B2Display deviceINNOLUX CORP·Filed 2017·Granted Mar 19, 2019·0 cites·20 claims
- 2460US10531563B2Display deviceINNOLUX CORP·Filed 2017·Granted Jan 7, 2020·0 cites·11 claims
- 2558US11631631B2Semiconductor device including via structure for vertical electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 18, 2023·0 cites·16 claims
- 2657US10854533B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 1, 2020·0 cites·19 claims
- 2757US10488690B2Display device and assembling method thereofINNOLUX CORP·Filed 2018·Granted Nov 26, 2019·0 cites·19 claims
- 2855US11784111B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 2955US11187851B2Display devicesINNOLUX CORP·Filed 2020·Granted Nov 30, 2021·0 cites·16 claims
- 3053US10324251B2Display modules and method for fabricating the sameINNOLUX CORP·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 3151US6944560B2Method for eliminating noise signals in radio signal receiving devicesLITE ON TECHNOLOGY CORP·Filed 2003·Granted Sep 13, 2005·2 cites·8 claims
- 3249US11806710B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 7, 2023·0 cites·20 claims
- 3348US10472228B2MEMS device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·0 cites·20 claims
- 3448US9519735B2Method of failure analysisTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·17 claims
- 3548US2017287863A1Semiconductor die, semiconductor wafer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Application pending·0 cites
- 3647US10317617B2Display device and method for preparing the sameINNOLUX CORP·Filed 2017·Granted Jun 11, 2019·0 cites·16 claims
- 3745US2018164629A1Display deviceINNOLUX CORP·Filed 2017·Application pending·0 cites
- 3839US10019540B2System and method for layout-related variation analysisTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·20 claims
- 3937US10236208B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 19, 2019·0 cites·17 claims
- 4032US2018122749A1Semiconductor wafer, semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →