Inventor · disambiguated record
Helen Zhu
Also filed as: ZHU HELEN · ZHU HELEN H
23 granted patents·8 pending applications·600 citations·filing 1995–2018
96Inventor score
Top patents by PatentIndex Score
31 records- 0197US9837286B2Systems and methods for selectively etching tungsten in a downstream reactorLAM RES CORP·Filed 2016·Granted Dec 5, 2017·104 cites·20 claims
- 0289US6670278B2Method of plasma etching of silicon carbideLAM RES CORP·Filed 2001·Granted Dec 30, 2003·54 cites·22 claims
- 0388US6090304AMethods for selective plasma etchLAM RES CORP·Filed 1997·Granted Jul 18, 2000·104 cites·6 claims
- 0487US7772122B2Sidewall forming processesLAM RES CORP·Filed 2008·Granted Aug 10, 2010·11 cites·22 claims
- 0585US9558928B2Contact clean in high-aspect ratio structuresLAM RES CORP·Filed 2014·Granted Jan 31, 2017·7 cites·20 claims
- 0685US6962879B2Method of plasma etching silicon nitrideLAM RES CORP·Filed 2001·Granted Nov 8, 2005·43 cites·30 claims
- 0784US5611888APlasma etching of semiconductorsLAM RES CORP·Filed 1996·Granted Mar 18, 1997·70 cites·3 claims
- 0882US9911620B2Method for achieving ultra-high selectivity while etching silicon nitrideLAM RES CORP·Filed 2015·Granted Mar 6, 2018·3 cites·20 claims
- 0982US6949460B2Line edge roughness reduction for trench etchLAM RES CORP·Filed 2003·Granted Sep 27, 2005·25 cites·12 claims
- 1081US5626716APlasma etching of semiconductorsLAM RES CORP·Filed 1995·Granted May 6, 1997·59 cites·18 claims
- 1178US7129171B2Selective oxygen-free etching process for barrier materialsLAM RES CORP·Filed 2003·Granted Oct 31, 2006·21 cites·15 claims
- 1275US6841483B2Unique process chemistry for etching organic low-k materialsLAM RES CORP·Filed 2001·Granted Jan 11, 2005·19 cites·13 claims
- 1371US7226852B1Preventing damage to low-k materials during resist strippingLAM RES CORP·Filed 2004·Granted Jun 5, 2007·13 cites·20 claims
- 1470US7288488B2Method for resist strip in presence of regular low k and/or porous low k dielectric materialsLAM RES CORP·Filed 2005·Granted Oct 30, 2007·3 cites·20 claims
- 1567US7541475B2Substituted thiazolesABBOTT LAB·Filed 2004·Granted Jun 2, 2009·4 cites·20 claims
- 1666US10192751B2Systems and methods for ultrahigh selective nitride etchLAM RES CORP·Filed 2016·Granted Jan 29, 2019·1 cites·28 claims
- 1764US6297163B1Method of plasma etching dielectric materialsLAM RES CORP·Filed 1998·Granted Oct 2, 2001·37 cites·27 claims
- 1862US7385287B2Preventing damage to low-k materials during resist strippingLAM RES CORP·Filed 2007·Granted Jun 10, 2008·1 cites·20 claims
- 1959US6916697B2Etch back process using nitrous oxideLAM RES CORP·Filed 2003·Granted Jul 12, 2005·6 cites·19 claims
- 2057US7049052B2Method providing an improved bi-layer photoresist patternLAM RES CORP·Filed 2003·Granted May 23, 2006·6 cites·15 claims
- 2156US7311852B2Method of plasma etching low-k dielectric materialsLAM RES CORP·Filed 2001·Granted Dec 25, 2007·6 cites·23 claims
- 2251US2018158692A1Apparatus for achieving ultra-high selectivity while etching silicon nitrideLAM RES CORP·Filed 2018·Application pending·0 cites
- 2350US7202177B2Nitrous oxide stripping process for organosilicate glassLAM RES CORP·Filed 2003·Granted Apr 10, 2007·2 cites·22 claims
- 2447US2009311871A1Organic arc etch selective for immersion photoresistLAM RES CORP·Filed 2008·Application pending·0 cites
- 2546US2005277289A1Line edge roughness reduction for trench etchWAGGANER ERIC·Filed 2005·Application pending·0 cites
- 2644US2016181116A1Selective nitride etchLAM RES CORP·Filed 2014·Application pending·0 cites
- 2743US2006166145A1Method providing an improved bi-layer photoresist patternXIAO HANZHONG·Filed 2006·Application pending·0 cites
- 2841US6949469B1Methods and apparatus for the optimization of photo resist etching in a plasma processing systemLAM RES CORP·Filed 2003·Granted Sep 27, 2005·1 cites·24 claims
- 2941US2005027128A1Substituted thiazolesFiled 2003·Application pending·0 cites
- 3039US2004171260A1Line edge roughness controlLAM RES CORP·Filed 2004·Application pending·0 cites
- 3139US2005101135A1Minimizing the loss of barrier materials during photoresist strippingLAM RES CORP·Filed 2003·Application pending·0 cites
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