Inventor · disambiguated record
Jairus Legaspi Pisigan
Also filed as: PISIGAN JAIRUS L · PISIGAN JAIRUS LEGASPI
38 granted patents·1 pending application·210 citations·filing 2007–2014
97Inventor score
Files withCAMACHO ZIGMUND RAMIREZ13STATS CHIPPAC LTD9BATHAN HENRY DESCALZO5BATHAN HENRY D4CAMACHO ZIGMUND R2
Top patents by PatentIndex Score
39 records- 0197US7915716B2Integrated circuit package system with leadframe arraySTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·62 cites·18 claims
- 0290US7691674B1Integrated circuit packaging system with stacked device and method of manufacturing thereofSTATS CHIPPAC LTD·Filed 2009·Granted Apr 6, 2010·19 cites·20 claims
- 0388US8110440B2Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structureBATHAN HENRY D·Filed 2009·Granted Feb 7, 2012·14 cites·31 claims
- 0488US8106499B2Integrated circuit packaging system with a dual substrate package and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Jan 31, 2012·15 cites·20 claims
- 0588US7977780B2Multi-layer package-on-package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 12, 2011·16 cites·20 claims
- 0686US8105915B2Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layersCAMACHO ZIGMUND R·Filed 2009·Granted Jan 31, 2012·12 cites·25 claims
- 0784US8354742B2Method and apparatus for a package having multiple stacked dieSTATS CHIPPAC LTD·Filed 2008·Granted Jan 15, 2013·11 cites·30 claims
- 0877US7977782B2Integrated circuit package system with dual connectivitySTATS CHIPPAC LTD·Filed 2007·Granted Jul 12, 2011·7 cites·18 claims
- 0975US8941219B2Etched recess package on package systemCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jan 27, 2015·3 cites·10 claims
- 1075US8338233B2Method of manufacture of integrated circuit packaging system with stacked integrated circuitCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Dec 25, 2012·3 cites·9 claims
- 1175US8304869B2Fan-in interposer on lead frame for an integrated circuit package on package systemCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Nov 6, 2012·6 cites·20 claims
- 1275US8080867B2Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Dec 20, 2011·5 cites·8 claims
- 1375US7915724B2Integrated circuit packaging system with base structure deviceSTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·6 cites·20 claims
- 1468US8304337B2Integrated circuit packaging system with bond wire pads and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2009·Granted Nov 6, 2012·3 cites·20 claims
- 1568US8067825B2Integrated circuit package system with multiple dieADVINCULA ABELARDO JR HADAP·Filed 2007·Granted Nov 29, 2011·6 cites·20 claims
- 1667US8766428B2Integrated circuit packaging system with flip chip and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Jul 1, 2014·3 cites·20 claims
- 1767US8236607B2Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2009·Granted Aug 7, 2012·3 cites·20 claims
- 1866US8513801B2Integrated circuit package systemTAY LIONEL CHIEN HUI·Filed 2008·Granted Aug 20, 2013·3 cites·20 claims
- 1966US8258614B2Integrated circuit package system with package integrationCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Sep 4, 2012·3 cites·20 claims
- 2065US9721925B2Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structureSTATS CHIPPAC LTD·Filed 2014·Granted Aug 1, 2017·1 cites·24 claims
- 2165US9472427B2Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor dieBATHAN HENRY D·Filed 2011·Granted Oct 18, 2016·2 cites·24 claims
- 2264US8502371B2Integrated circuit package system with extended corner leadsCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Aug 6, 2013·2 cites·20 claims
- 2361US7932130B2Method for forming an etched recess package on package systemSTATS CHIPPAC LTD·Filed 2008·Granted Apr 26, 2011·1 cites·8 claims
- 2460US8802555B2Integrated circuit packaging system with interconnects and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2011·Granted Aug 12, 2014·1 cites·20 claims
- 2557US8802505B2Semiconductor device and method of forming a protective layer on a backside of the waferBATHAN HENRY D·Filed 2008·Granted Aug 12, 2014·1 cites·33 claims
- 2657US8129827B2Integrated circuit package system with package encapsulation having recessCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Mar 6, 2012·1 cites·20 claims
- 2756US8558369B2Integrated circuit packaging system with interconnects and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Oct 15, 2013·1 cites·5 claims
- 2854US7777354B2Integrated circuit package system with leaded packageSTATS CHIPPAC LTD·Filed 2008·Granted Aug 17, 2010·0 cites·14 claims
- 2952US8148825B2Integrated circuit package system with leadfingerCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Apr 3, 2012·0 cites·20 claims
- 3051US8890328B2Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layersCAMACHO ZIGMUND R·Filed 2011·Granted Nov 18, 2014·0 cites·28 claims
- 3151US8872320B2Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structureBATHAN HENRY D·Filed 2012·Granted Oct 28, 2014·0 cites·32 claims
- 3251US8652881B2Integrated circuit package system with anti-peel contact padsCAMACHO ZIGMUND RAMIREZ·Filed 2008·Granted Feb 18, 2014·0 cites·20 claims
- 3350US8148208B2Integrated circuit package system with leaded package and method for manufacturing thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Apr 3, 2012·0 cites·14 claims
- 3449US8106502B2Integrated circuit packaging system with plated pad and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2008·Granted Jan 31, 2012·0 cites·20 claims
- 3546US8278148B2Integrated circuit package system with leads separated from a die paddlePUNZALAN JEFFREY D·Filed 2007·Granted Oct 2, 2012·0 cites·14 claims
- 3644US8643157B2Integrated circuit package system having perimeter paddleTAY LIONEL CHIEN HUI·Filed 2007·Granted Feb 4, 2014·0 cites·6 claims
- 3742US9034692B2Integrated circuit packaging system with a flip chip and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2011·Granted May 19, 2015·0 cites·20 claims
- 3839US2010078831A1Integrated circuit package system with singulation processPISIGAN JAIRUS LEGASPI·Filed 2008·Application pending·0 cites
- 3938US8637394B2Integrated circuit package system with flex bumpPISIGAN JAIRUS LEGASPI·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
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