Inventor · disambiguated record
Wei-Min Hsiao
Also filed as: HSIAO WEI-MIN
21 granted patents·10 pending applications·325 citations·filing 2001–2021
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG16NAT CHUNG SHAN INST SCIENCE & TECH8HSIAO WEI-MIN3ADVANCE SEMICONDUCTOR ENGINEER1NAT INST CHUNG SHAN SCIENCE & TECHNOLOGY1
Top patents by PatentIndex Score
31 records- 0197US7829961B2MEMS microphone package and method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 9, 2010·117 cites·10 claims
- 0295US7808060B2MEMS microphone module and method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Oct 5, 2010·39 cites·10 claims
- 0391US11658370B2Safety protection device and method for battery test systemNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2021·Granted May 23, 2023·2 cites·2 claims
- 0491US7560744B2Package optical chip with conductive pillarsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 14, 2009·26 cites·8 claims
- 0591US7238590B2Package structure of semiconductor and wafer-level formation thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 3, 2007·24 cites·9 claims
- 0690US6700178B2Package of a chip with beveled edgesADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 2, 2004·64 cites·10 claims
- 0789US7563652B2Method for encapsulating sensor chipsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 21, 2009·20 cites·14 claims
- 0888US11169212B2External battery short-circuit testing deviceNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2020·Granted Nov 9, 2021·2 cites·9 claims
- 0988US10063070B2Battery active balancing systemNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2016·Granted Aug 28, 2018·9 cites·10 claims
- 1076US10536020B2Charging control apparatus, charging control method and computer readable medium thereofNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Jan 14, 2020·3 cites·14 claims
- 1175US7573124B2Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 11, 2009·7 cites·11 claims
- 1269US8194896B2Packaging structure and method of a MEMS microphoneHSIAO WEI-MIN·Filed 2008·Granted Jun 5, 2012·5 cites·18 claims
- 1365US10377262B2Range extending apparatus for electric vehicle and control method thereofNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2016·Granted Aug 13, 2019·2 cites·11 claims
- 1464US8975157B2Carrier bonding and detaching processes for a semiconductor waferHSIAO WEI-MIN·Filed 2012·Granted Mar 10, 2015·2 cites·12 claims
- 1562US10594143B2Charging method for battery set and battery management system using the sameNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Mar 17, 2020·1 cites·18 claims
- 1660US11675018B1Portable battery detection deviceNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2021·Granted Jun 13, 2023·0 cites·19 claims
- 1760US8053367B2Wafer polishing methodADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 8, 2011·2 cites·10 claims
- 1850US7674688B2Sawing method for a semiconductor element with a microelectromechanical systemADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Mar 9, 2010·0 cites·17 claims
- 1948US2007187711A1Wafer level package for image sensor components and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2046US2009140413A1Semiconductor package structure, applications thereof and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2146US2009189255A1Wafer having heat dissipation structure and method of fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 2244US2006192284A1Method of forming an encapsulation layer on a back side of a waferADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2343US10404527B2Link reestablishment method and electrical system using the sameNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 2442US9929078B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 27, 2018·0 cites·19 claims
- 2542US2007252261A1Semiconductor device packageWANG MENG-JEN·Filed 2006·Application pending·0 cites
- 2642US2016178706A1Method and apparatus of detecting states of batteryNAT INST CHUNG SHAN SCIENCE & TECHNOLOGY·Filed 2014·Application pending·0 cites
- 2741US2006278974A1Method for forming wafer-level heat spreader structure and package structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2840US2006211173A1Package of image sensor device and formation thereofADVANCE SEMICONDUCTOR ENGINEER·Filed 2006·Application pending·0 cites
- 2939US2005067720A1Method of forming an encapsulation layer on a back side of a waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 3038US2006255253A1Method for packaging an image sensor die and a package thereofHSIAO WEI-MIN·Filed 2005·Application pending·0 cites
- 3133US8865520B2Carrier bonding and detaching processes for a semiconductor waferYANG KUO-PIN·Filed 2011·Granted Oct 21, 2014·0 cites·18 claims
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