Inventor · disambiguated record
Hai P. Longworth
Also filed as: LONGWORTH HAI P · LONGWORTH HAI PHAM
5 granted patents·2 pending applications·86 citations·filing 2000–2012
77Inventor score
Top patents by PatentIndex Score
7 records- 0189US6391669B1Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devicesIBM·Filed 2000·Granted May 21, 2002·71 cites·26 claims
- 0281US8232655B2Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2008·Granted Jul 31, 2012·9 cites·20 claims
- 0370US7302757B2Micro-bumps to enhance LGA interconnectionsIBM·Filed 2005·Granted Dec 4, 2007·6 cites·10 claims
- 0450US8587112B2Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2012·Granted Nov 19, 2013·0 cites·20 claims
- 0541US8367543B2Structure and method to improve current-carrying capabilities of C4 jointsIBM·Filed 2006·Granted Feb 5, 2013·0 cites·9 claims
- 0639US2006211167A1Methods and systems for improving microelectronic i/o current capabilitiesIBM·Filed 2005·Application pending·0 cites
- 0735US2005221635A1Micro-bumps to enhance lga interconnectionsIBM·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →