Inventor
MITSUISHI HAJIME
JP17 patents
⚠️ This page may combine multiple inventors who share the name “MITSUISHI HAJIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIKON CORP
15 patentsUS11004686B2May 11, 2021
Bonding method, bonding device, and holding member
NIKON CORP7 citations82
US11842905B2Dec 12, 2023
Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus
NIKON CORP6 citations74
US11211338B2Dec 28, 2021
Apparatus for stacking substrates and method for the same
NIKON CORP2 citations73
US10483212B2Nov 19, 2019
Apparatus for stacking substrates and method for the same
NIKON CORP4 citations73
US12506111B2Dec 23, 2025
Alignment method and alignment apparatus
NIKON CORP0 citations62
US12100667B2Sep 24, 2024
Apparatus for stacking substrates and method for the same
NIKON CORP0 citations62
US11823935B2Nov 21, 2023
Stacking apparatus and stacking method
NIKON CORP0 citations62
US11362059B2Jun 14, 2022
Manufacturing method and manufacturing apparatus for stacked substrate, and program
NIKON CORP0 citations62
US10825707B2Nov 3, 2020
Stacking apparatus and stacking method
NIKON CORP1 citations62
US12080554B2Sep 3, 2024
Bonding method, bonding device, and holding member
NIKON CORP0 citations60
US11791223B2Oct 17, 2023
Substrate bonding apparatus and substrate bonding method
NIKON CORP1 citations56
US12165902B2Dec 10, 2024
Substrate bonding apparatus and substrate bonding method
NIKON CORP0 citations51
US12107068B2Oct 1, 2024
Method and device for manufacturing stacked substrate
NIKON CORP0 citations51
US10424557B2Sep 24, 2019
Substrate bonding apparatus and substrate bonding method
NIKON CORP0 citations51
US12447728B2Oct 21, 2025
Bonding method and bonding device
NIKON CORP0 citations47