Inventor · disambiguated record
Cornelia K. Tsang
Also filed as: TSANG CORNELIA K · TSANG CORNELIA K-I · TSANG CORNELIA KANG-I
79 granted patents·12 pending applications·954 citations·filing 2003–2020
99Inventor score
Top patents by PatentIndex Score
91 records- 0198US8917210B2Package structures to improve on-chip antenna performanceIBM·Filed 2012·Granted Dec 23, 2014·189 cites·30 claims
- 0298US7488680B2Conductive through via process for electronic device carriersIBM·Filed 2005·Granted Feb 10, 2009·87 cites·11 claims
- 0397US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0495US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 0595US9472789B2Thin, flexible microsystem with integrated energy sourceIBM·Filed 2014·Granted Oct 18, 2016·9 cites·19 claims
- 0695US9269561B2Wafer debonding using long-wavelength infrared radiation ablationGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 23, 2016·16 cites·11 claims
- 0795US7750459B2Integrated module for data processing systemIBM·Filed 2008·Granted Jul 6, 2010·29 cites·17 claims
- 0894US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 0994US9472859B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2014·Granted Oct 18, 2016·16 cites·12 claims
- 1093US10297479B2Wafer debonding using mid-wavelength infrared radiation ablationIBM·Filed 2017·Granted May 21, 2019·8 cites·18 claims
- 1193US7435627B2Techniques for providing decoupling capacitanceIBM·Filed 2005·Granted Oct 14, 2008·18 cites·11 claims
- 1292US9313921B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2013·Granted Apr 12, 2016·12 cites·19 claims
- 1392US7808798B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2008·Granted Oct 5, 2010·27 cites·14 claims
- 1492US7741226B2Optimal tungsten through wafer via and process of fabricating sameIBM·Filed 2008·Granted Jun 22, 2010·31 cites·22 claims
- 1592US7518229B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2006·Granted Apr 14, 2009·31 cites·3 claims
- 1691US10103450B2Integration of area efficient antennas for phased array or wafer scale array antenna applicationsIBM·Filed 2016·Granted Oct 16, 2018·7 cites·20 claims
- 1791US9795964B2Direct bond transfer layers for manufacturable sealing of microfluidic chipsIBM·Filed 2015·Granted Oct 24, 2017·4 cites·13 claims
- 1891US9355936B2Flattened substrate surface for substrate bondingGLOBALFOUNDRIES INC·Filed 2014·Granted May 31, 2016·16 cites·20 claims
- 1991US9324601B1Low temperature adhesive resins for wafer bondingIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 2091US8617689B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedCHEN KUAN-NENG·Filed 2012·Granted Dec 31, 2013·10 cites·9 claims
- 2191US8138036B2Through silicon via and method of fabricating sameANDRY PAUL STEPHEN·Filed 2008·Granted Mar 20, 2012·18 cites·16 claims
- 2290US9159602B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersANDRY PAUL S·Filed 2009·Granted Oct 13, 2015·14 cites·13 claims
- 2389US8487425B2Optimized annular copper TSVANDRY PAUL S·Filed 2011·Granted Jul 16, 2013·9 cites·15 claims
- 2489US8419895B2Laser ablation for integrated circuit fabricationDANG BING·Filed 2010·Granted Apr 16, 2013·11 cites·20 claims
- 2589US7645701B2Silicon-on-insulator structures for through via in silicon carriersIBM·Filed 2007·Granted Jan 12, 2010·15 cites·16 claims
- 2688US8637937B2Through silicon via for use in integrated circuit chipsANDRY PAUL STEPHEN·Filed 2012·Granted Jan 28, 2014·7 cites·16 claims
- 2788US8198734B2Silicon-on-insulator structures for through via in silicon carriersANDERSON BRENT A·Filed 2009·Granted Jun 12, 2012·14 cites·12 claims
- 2888US7678696B2Method of making through wafer viasIBM·Filed 2008·Granted Mar 16, 2010·16 cites·20 claims
- 2987US9648782B2Chip stack structures that implement two-phase cooling with radial flowIBM·Filed 2016·Granted May 9, 2017·5 cites·18 claims
- 3087US9636782B2Wafer debonding using mid-wavelength infrared radiation ablationIBM·Filed 2014·Granted May 2, 2017·6 cites·14 claims
- 3187US8012796B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersIBM·Filed 2009·Granted Sep 6, 2011·11 cites·5 claims
- 3287US7488624B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Feb 10, 2009·9 cites·11 claims
- 3385US7799613B2Integrated module for data processing systemIBM·Filed 2009·Granted Sep 21, 2010·10 cites·19 claims
- 3485US7683478B2Hermetic seal and reliable bonding structures for 3D applicationsIBM·Filed 2008·Granted Mar 23, 2010·9 cites·3 claims
- 3584US8735251B2Through silicon via and method of fabricating sameULTRATECH INC·Filed 2013·Granted May 27, 2014·5 cites·11 claims
- 3684US8679280B2Laser ablation of adhesive for integrated circuit fabricationDANG BING·Filed 2010·Granted Mar 25, 2014·7 cites·19 claims
- 3784US8298917B2Process for wet singulation using a dicing singulation structureANDRY PAUL S·Filed 2009·Granted Oct 30, 2012·9 cites·19 claims
- 3883US9362223B2Integrated circuit assembly with cushion polymer layerIBM·Filed 2015·Granted Jun 7, 2016·4 cites·7 claims
- 3983US8263497B2High-yield method of exposing and contacting through-silicon viasANDRY PAUL S·Filed 2009·Granted Sep 11, 2012·11 cites·18 claims
- 4083US7691669B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Apr 6, 2010·7 cites·15 claims
- 4183US7060624B2Deep filled viasIBM·Filed 2003·Granted Jun 13, 2006·28 cites·16 claims
- 4282US8592932B2Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriersANDRY PAUL S·Filed 2012·Granted Nov 26, 2013·4 cites·8 claims
- 4381US8440544B2CMOS structure and method of manufactureANDRY PAUL S·Filed 2010·Granted May 14, 2013·4 cites·21 claims
- 4481US7791168B2Techniques for providing decoupling capacitanceIBM·Filed 2007·Granted Sep 7, 2010·6 cites·15 claims
- 4580US8241995B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectricCHEN KUAN-NENG·Filed 2006·Granted Aug 14, 2012·7 cites·18 claims
- 4679US9748131B2Low temperature adhesive resins for wafer bondingIBM·Filed 2015·Granted Aug 29, 2017·2 cites·13 claims
- 4779US9586291B2Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation releaseGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 7, 2017·3 cites·13 claims
- 4878US8778737B2Flattened substrate surface for substrate bondingCOONEY III EDWARD C·Filed 2011·Granted Jul 15, 2014·4 cites·22 claims
- 4978US7902069B2Small area, robust silicon via structure and processIBM·Filed 2007·Granted Mar 8, 2011·6 cites·9 claims
- 5077US7741231B2Techniques for providing decoupling capacitanceIBM·Filed 2008·Granted Jun 22, 2010·4 cites·12 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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