Inventor · disambiguated record
Ruedi Grueter
Also filed as: GRUETER RUEDI
6 granted patents·1 pending application·31 citations·filing 2001–2014
78Inventor score
Files withESEC TRADING SA2BAUMANN DAMIAN1BESI SWITZERLAND AG1BLESSING PATRICK1OERLIKON ASSEMBLY EQUIPMENT AG1
Top patents by PatentIndex Score
7 records- 0179US9233389B2Device for dispensing adhesive on a substrateBESI SWITZERLAND AG·Filed 2014·Granted Jan 12, 2016·5 cites·2 claims
- 0279US7597234B2Method for mounting a flip chip on a substrateOERLIKON ASSEMBLY EQUIPMENT AG·Filed 2006·Granted Oct 6, 2009·16 cites·2 claims
- 0362US8166637B2Apparatus for mounting a flip chip on a substrateBLESSING PATRICK·Filed 2008·Granted May 1, 2012·4 cites·4 claims
- 0451US7020954B2Apparatus for placing a semiconductor chip as a flipchip on a substrateESEC TRADING SA·Filed 2002·Granted Apr 4, 2006·5 cites·20 claims
- 0537US2010019018A1Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering FluxBAUMANN DAMIAN·Filed 2007·Application pending·0 cites
- 0636US6585145B2Die bonder and/or wire bonder with a device for holding down a substrateESEC TRADING SA·Filed 2001·Granted Jul 1, 2003·1 cites·4 claims
- 0731US9603294B2Apparatus for mounting semiconductor chipsSUTER GUIDO·Filed 2012·Granted Mar 21, 2017·0 cites·2 claims
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