Inventor
HANASHIMA TAKEO
JP31 patents
⚠️ This page may combine multiple inventors who share the name “HANASHIMA TAKEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
16 patentsUS10808318B2Oct 20, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP3 citations73
US10640872B2May 5, 2020
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations72
US12437987B2Oct 7, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12065741B2Aug 20, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11952664B2Apr 9, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US11923188B2Mar 5, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11365482B2Jun 21, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12400855B2Aug 26, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11784044B2Oct 10, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations60
US12529137B2Jan 20, 2026
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations58
US11753716B2Sep 12, 2023
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations58
US12351908B2Jul 8, 2025
Substrate processing method, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations52
US11387097B2Jul 12, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations47
US11814725B2Nov 14, 2023
Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations44
HITACHI INT ELECTRIC INC
13 patentsUS9536734B2Jan 3, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC7 citations84
US9349586B2May 24, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC8 citations84
US10032626B2Jul 24, 2018
Method of manufacturing semiconductor device by forming a film on a substrate, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC9 citations82
US11542601B2Jan 3, 2023
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations73
US9728400B2Aug 8, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
US7795143B2Sep 14, 2010
Substrate processing apparatus and manufacturing method of semiconductor device
HITACHI INT ELECTRIC INC6 citations71
US10388512B2Aug 20, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
US12040179B2Jul 16, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations60
US9831082B2Nov 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC1 citations52
US9673043B2Jun 6, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording medium
HITACHI INT ELECTRIC INC1 citations52
US9514935B2Dec 6, 2016
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and program
HITACHI INT ELECTRIC INC0 citations52
US8367530B2Feb 5, 2013
Substrate processing apparatus and manufacturing method of semiconductor device
HITACHI INT ELECTRIC INC0 citations49
US9530641B2Dec 27, 2016
Method for manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations42