Inventor · disambiguated record
Robert A. Maraschin
Also filed as: MARASCHIN ROBERT · MARASCHIN ROBERT A
20 granted patents·1,419 citations·filing 1990–2010
97Inventor score
Top patents by PatentIndex Score
20 records- 0199US6129808ALow contamination high density plasma etch chambers and methods for making the sameLAM RES CORP·Filed 1998·Granted Oct 10, 2000·215 cites·38 claims
- 0298US6394026B1Low contamination high density plasma etch chambers and methods for making the sameLAM RES CORP·Filed 2000·Granted May 28, 2002·107 cites·30 claims
- 0397US5863376ATemperature controlling method and apparatus for a plasma processing chamberLAM RES CORP·Filed 1996·Granted Jan 26, 1999·281 cites·23 claims
- 0495US5993594AParticle controlling method and apparatus for a plasma processing chamberLAM RES CORP·Filed 1996·Granted Nov 30, 1999·94 cites·18 claims
- 0593US6583064B2Low contamination high density plasma etch chambers and methods for making the sameLAM RES CORP·Filed 2002·Granted Jun 24, 2003·89 cites·13 claims
- 0692US6464843B1Contamination controlling method and apparatus for a plasma processing chamberLAM RES CORP·Filed 1999·Granted Oct 15, 2002·75 cites·28 claims
- 0792US6408786B1Semiconductor processing equipment having tiled ceramic linerLAM RES CORP·Filed 1999·Granted Jun 25, 2002·97 cites·20 claims
- 0891US6227140B1Semiconductor processing equipment having radiant heated ceramic linerLAM RES CORP·Filed 1999·Granted May 8, 2001·119 cites·20 claims
- 0990US6200415B1Load controlled rapid assembly clamp ringLAM RES CORP·Filed 1999·Granted Mar 13, 2001·97 cites·29 claims
- 1087US5805408AElectrostatic clamp with lip seal for clamping substratesLAM RES CORP·Filed 1995·Granted Sep 8, 1998·86 cites·32 claims
- 1185US5098741AMethod and system for delivering liquid reagents to processing vesselsLAM RES CORP·Filed 1990·Granted Mar 24, 1992·62 cites·19 claims
- 1280US6251793B1Particle controlling method for a plasma processing chamberLAM RES CORP·Filed 1999·Granted Jun 26, 2001·29 cites·10 claims
- 1377US7862693B2Apparatus for plating semiconductor wafersLAM RES CORP·Filed 2009·Granted Jan 4, 2011·4 cites·14 claims
- 1467US7811423B2Proximity processing using controlled batch volume with an integrated proximity headLAM RES CORP·Filed 2006·Granted Oct 12, 2010·2 cites·18 claims
- 1567US7648616B1Apparatus and method for semiconductor wafer electroplanarizationLAM RES CORP·Filed 2006·Granted Jan 19, 2010·2 cites·20 claims
- 1663US6306244B1Apparatus for reducing polymer deposition on substrate supportLAM RES CORP·Filed 1999·Granted Oct 23, 2001·28 cites·29 claims
- 1760US6035868AMethod and apparatus for control of deposit build-up on an inner surface of a plasma processing chamberLAM RES CORP·Filed 1997·Granted Mar 14, 2000·21 cites·15 claims
- 1848US7645364B2Apparatus and method for plating semiconductor wafersLAM RES CORP·Filed 2004·Granted Jan 12, 2010·1 cites·6 claims
- 1946US6155203AApparatus for control of deposit build-up on an inner surface of a plasma processing chamberLAM RES CORP·Filed 1999·Granted Dec 5, 2000·10 cites·8 claims
- 2041US8221608B2Proximity processing using controlled batch volume with an integrated proximity headWOODS CARL A·Filed 2010·Granted Jul 17, 2012·0 cites·7 claims
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