Inventor · disambiguated record
Scott Gilbert
Also filed as: GILBERT SCOTT · GILBERT SCOTT A
13 granted patents·3 pending applications·56 citations·filing 2003–2022
90Inventor score
Top patents by PatentIndex Score
16 records- 0193US11528809B2Method for orienting solder balls on a BGA deviceTAHOE RES LTD·Filed 2021·Granted Dec 13, 2022·2 cites·21 claims
- 0291US9293426B2Land side and die side cavities to reduce package Z-heightHOSSAIN MD ALTAF·Filed 2012·Granted Mar 22, 2016·12 cites·26 claims
- 0385US9721882B2Land side and die side cavities to reduce package z-heightINTEL CORP·Filed 2017·Granted Aug 1, 2017·3 cites·20 claims
- 0482US7253523B2Reworkable thermal interface materialINTEL CORP·Filed 2003·Granted Aug 7, 2007·28 cites·29 claims
- 0581US10297542B2Land side and die side cavities to reduce package z-heightINTEL CORP·Filed 2017·Granted May 21, 2019·2 cites·12 claims
- 0680US9799556B2Land side and die side cavities to reduce package z-heightINTEL CORP·Filed 2016·Granted Oct 24, 2017·2 cites·13 claims
- 0778US2023112097A1Method for orienting solder balls on a bga deviceTAHOE RES LTD·Filed 2022·Application pending·0 cites
- 0870US9237659B2BGA structure using CTF balls in high stress regionsHOSSAIN MD ALTAF·Filed 2012·Granted Jan 12, 2016·1 cites·20 claims
- 0962US10980134B2Method for orienting solder balls on a BGA deviceINTEL CORP·Filed 2019·Granted Apr 13, 2021·0 cites·9 claims
- 1062US10950537B2Land side and die side cavities to reduce package z-heightINTEL CORP·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1154US10278292B2Method for orienting solder balls on a BGA deviceINTEL CORP·Filed 2016·Granted Apr 30, 2019·0 cites·8 claims
- 1246US7098534B2Sacrificial componentINTEL CORP·Filed 2004·Granted Aug 29, 2006·2 cites·15 claims
- 1345US7241147B2Making electrical connections between a circuit board and an integrated circuitINTEL CORP·Filed 2004·Granted Jul 10, 2007·4 cites·15 claims
- 1444US2006288567A1Sacrificial componentINTEL CORP·Filed 2006·Application pending·0 cites
- 1538US11538753B2Electronic chip with under-side power blockINTEL CORP·Filed 2016·Granted Dec 27, 2022·0 cites·20 claims
- 1636US2012161312A1Non-solder metal bumps to reduce package heightHOSSAIN MD ALTAF·Filed 2010·Application pending·0 cites
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