Inventor · disambiguated record
Hiroaki Umehara
Also filed as: UMEHARA HIROAKI
8 granted patents·14 pending applications·9 citations·filing 2012–2025
76Inventor score
Top patents by PatentIndex Score
22 records- 0191US11066548B2Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 20, 2021·2 cites·10 claims
- 0286US9125307B2Flexible metal-cladded base material, method for producing flexible metal-cladded base material, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring boardPANASONIC CORP·Filed 2012·Granted Sep 1, 2015·7 cites·17 claims
- 0381US12173151B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·12 claims
- 0478US2025230279A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0566US11866580B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 9, 2024·0 cites·11 claims
- 0666US2022243013A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 0765US2018312683A1Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 0862US11365274B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·13 claims
- 0961US2023331957A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1061US2023399511A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1160US11945910B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·12 claims
- 1259US2023323104A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1359US2024368323A1Resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1459US2023331944A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1558US12122129B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·12 claims
- 1657US2022356349A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1756US2023323000A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1847US2020181403A1Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1942US10543661B2Metal foil with resin, and metal-clad laminate and circuit board using samePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 28, 2020·0 cites·10 claims
- 2041US2016090457A1Prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2139US2015259489A1Prepreg, metal-clad laminate and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 2235US2016168378A1Poly(phenylene ether) resin composition, prepreg, metal-clad laminate, and printed-wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →