Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board

Abstract

A polyphenylene ether resin composition contains a modified polyphenylene ether copolymer and a high-molecular-weight compound. The modified polyphenylene ether copolymer is obtained by modifying a polyphenylene ether copolymer at a phenolic hydroxy group of a molecular chain end with a substituent having a carbon-carbon unsaturated double bond. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

What is claimed is: 
     
         1 . A polyphenylene ether resin composition comprising:
 a modified polyphenylene ether copolymer that a phenolic hydroxy group at a molecular chain end of a polyphenylene ether copolymer is substituted with a substituent having a carbon-carbon unsaturated double bond; and   a high-molecular-weight compound having a number-average molecular weight Mn ranging from 1000 to 10000, inclusive and having a glass transition temperature (Tg) of 20° C. or lower, the glass transition temperature being measured by differential scanning calorimetry, wherein   the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound in a cured state of the polyphenylene ether resin composition.   
     
     
         2 . The polyphenylene ether resin composition according to  claim 1 , further comprising a crosslinking agent for the modified polyphenylene ether copolymer, the crosslinking agent having at least two carbon-carbon unsaturated double bonds per molecule. 
     
     
         3 . The polyphenylene ether resin composition according to  claim 1 , wherein the high-molecular-weight compound has a structure of at least one selected from a polybutadiene skeleton and a (meth)acrylate skeleton. 
     
     
         4 . The polyphenylene ether resin composition according to  claim 1 , wherein the modified polyphenylene ether copolymer has a weight-average molecular weight ranging from 500 to 5000, inclusive and includes 1 to 3 functional groups. 
     
     
         5 . The polyphenylene ether resin composition according to  claim 1 , wherein the substituent at a molecular chain end of the modified polyphenylene ether copolymer is represented by following formula (1): 
       
         
           
           
               
               
           
         
         where n represents an integer of 0 to 10, Z represents an arylene group, and R 1  to R 3  independently represent a hydrogen atom or an alkyl group, wherein Z represents either the arylene group or a carbonyl group when n equals 0. 
       
     
     
         6 . The polyphenylene ether resin composition according to  claim 2 , wherein the crosslinking agent is a compound represented by a following formula: 
       
         
           
           
               
               
           
         
         where m represents an integer of 1 to 3, n represents 0 or 1, R 1  to R 3  independently represent a hydrogen atom or an alkyl group, X represents any one of an arylene group, a group having a tricyclodecane skeleton, and an isocyanurate group, and Y represents 
       
       
         
           
           
               
               
           
         
       
       where L represents an integer of 1 or more. 
     
     
         7 . The polyphenylene ether resin composition according to  claim 1 , further comprising an inorganic filler. 
     
     
         8 . The polyphenylene ether resin composition according to  claim 2 , further comprising an inorganic filler. 
     
     
         9 . The polyphenylene ether resin composition according to  claim 8 , wherein a content ratio of the inorganic filler ranges from 40 parts by mass to 200 parts by mass, inclusive, relative to 100 parts by mass of a total of the modified polyphenylene ether copolymer, the high-molecular-weight compound, and the crosslinking agent. 
     
     
         10 . The polyphenylene ether resin composition according to  claim 1 , further comprising a reaction initiator. 
     
     
         11 . The polyphenylene ether resin composition according to  claim 1 , further comprising a flame retardant. 
     
     
         12 . A prepreg comprising:
 a resin layer including a half-cured product of the polyphenylene ether resin composition according to  claim 1 ; and   a fibrous substrate provided in the resin layer.   
     
     
         13 . A metal-clad laminate comprising:
 a cured product of the prepreg according to  claim 12 ; and   a metal foil provided on at least one surface of the cured product.   
     
     
         14 . A printed wiring board comprising:
 a cured product of the prepreg according to  claim 12 ; and   a conductor pattern provided as a circuit on a surface of the cured product.