Inventor · disambiguated record

Hiroharu Inoue

Also filed as: INOUE HIROHARU

31 granted patents·26 pending applications·74 citations·filing 1986–2025

94Inventor score

Technology areasH05K C08J B32B C08G C08L

Files withPANASONIC IP MAN CO LTD37 NIPPON STEEL CORP5 PANASONIC CORP5 INOUE HIROHARU4 TOSHIBA MATSUSHITA DISPLAY TEC3

Top patents by PatentIndex Score

57 records

0191US11066548B2Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 20, 2021·2 cites·10 claims
0284US10371612B2Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·11 claims
0384US7838576B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetPANASONIC ELEC WORKS CO LTD·Filed 2008·Granted Nov 23, 2010·6 cites·19 claims
0481US12173151B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·12 claims
0580US7413791B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Aug 19, 2008·15 cites·19 claims
0678US4845185ASoluble copolyimide from 9,9-bis (4-amino phenyl) fluoreneNIPPON STEEL CORP·Filed 1987·Granted Jul 4, 1989·24 cites·5 claims
0778US2025230279A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
0874US11905409B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2023·Granted Feb 20, 2024·0 cites·16 claims
0968US4820868AProcess for preparation of naphthalene-2,6-dicarboxylic acid dialkali metal saltsNIPPON STEEL CORP·Filed 1986·Granted Apr 11, 1989·9 cites·7 claims
1066US11866580B2Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 9, 2024·0 cites·11 claims
1166US2022243013A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
1265US2018312683A1Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
1363US2025108582A1Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
1462US11365274B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·13 claims
1562US2023357558A1Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
1661US2023331957A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
1760US11945910B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·12 claims
1860US9736935B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
1959US12098257B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·15 claims
2059US2023323104A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
2159US2024368323A1Resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
2259US2023331944A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
2358US12122129B2Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·12 claims
2456US9516746B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted Dec 6, 2016·0 cites·5 claims
2555US9795030B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 17, 2017·0 cites·9 claims
2655US9661749B2Metal-clad laminate and printed wiring boardPANASONIC CORP·Filed 2012·Granted May 23, 2017·0 cites·12 claims
2755US2023250282A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
2854US9585248B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·12 claims
2954US9102850B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 11, 2015·0 cites·8 claims
3054US2024190112A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
3153US2023257581A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
3250US11407869B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 9, 2022·0 cites·9 claims
3350US9578734B2Prepreg, metal-clad laminate, and printed wiring boardPANASONIC CORP·Filed 2013·Granted Feb 21, 2017·0 cites·18 claims
3448US12275846B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·13 claims
3547US11059260B2Prepreg, metal-clad laminated board, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 13, 2021·0 cites·16 claims
3647US2020181403A1Poly(phenylene ether) resin composition, and prepreg, metal-clad laminate, and wiring board each obtained using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
3746US11234329B2Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 25, 2022·0 cites·6 claims
3846US9894761B2Prepreg, metal-clad laminated plate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·7 claims
3946US4794159AHeat-resistant polyamide from bis(4-aminophenyl)fluoreneNIPPON STEEL CORP·Filed 1987·Granted Dec 27, 1988·6 cites·4 claims
4046US2024239974A1Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
4144US10009997B2Metal-clad laminate and printed wiring boardINOUE HIROHARU·Filed 2012·Granted Jun 26, 2018·0 cites·11 claims
4244US2022259363A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
4343US5006631AAromatic polyester carbonate from diphenol mixtureNIPPON STEEL CORP·Filed 1989·Granted Apr 9, 1991·5 cites·12 claims
4443US4833214ASoluble heat-resistant aromatic polyamide terminated with aromatic amido moietiesNIPPON STEEL CORP·Filed 1986·Granted May 23, 1989·5 cites·9 claims
4543US2007182888A1Liquid crystal display deviceTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites
4642US10543661B2Metal foil with resin, and metal-clad laminate and circuit board using samePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 28, 2020·0 cites·10 claims
4742US2024165922A1Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
4841US2016090457A1Prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
4940US2008055524A1Liquid crystal display deviceTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites
5039US2007221923A1Array substrate and method of manufacturing the sameTOSHIBA MATSUSHITA DISPLAY TEC·Filed 2007·Application pending·0 cites

Showing the top 50 of 57 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Hiroharu Inoue files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →