Inventor

EGASHIRA ETUO

JP4 patents

⚠️ This page may combine multiple inventors who share the name “EGASHIRA ETUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

3 patents

US4783225ANov 8, 1988

Wafer and method of working the same

HITACHI LTD27 citations91

US5279992AJan 18, 1994

Method of producing a wafer having a curved notch

HITACHI LTD18 citations81

US5230747AJul 27, 1993

Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer

HITACHI LTD17 citations81

RENESAS TECH CORP

1 patent

USRE40139EMar 4, 2008

Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer

RENESAS TECH CORP1 citations51