Inventor · disambiguated record

D. J. Perng

Also filed as: PERNG D J

1 granted patent·1 pending application·0 citations·filing 2006–2006

3Inventor score

Technology areasH10D H10W

Files withTAIWAN SEMICONDUCTOR MFG1 TSAO PEI-HAW1

Top patents by PatentIndex Score

2 records

0137US7462885B2ESD structure for high voltage ESD protectionTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 9, 2008·0 cites·17 claims
0230US2008003803A1Semiconductor package substrate for flip chip packagingTSAO PEI-HAW·Filed 2006·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →