Inventor · disambiguated record
Sadayuki Okuni
Also filed as: OKUNI SADAYUKI
7 granted patents·1 pending application·323 citations·filing 1997–2007
88Inventor score
Files withSHINETSU HANDOTAI KK8
Top patents by PatentIndex Score
8 records- 0194US5942445AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 24, 1999·163 cites·20 claims
- 0288US6652358B1Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machineSHINETSU HANDOTAI KK·Filed 2000·Granted Nov 25, 2003·39 cites·22 claims
- 0376US6491836B1Semiconductor wafer and production method thereforSHINETSU HANDOTAI KK·Filed 1999·Granted Dec 10, 2002·52 cites·18 claims
- 0469US6050880ASurface grinding device and method of surface grinding a thin-plate workpieceSHINETSU HANDOTAI KK·Filed 1997·Granted Apr 18, 2000·31 cites·18 claims
- 0560US7179330B2Method of manufacturing silicon single crystal, silicon single crystal and silicon waferSHINETSU HANDOTAI KK·Filed 2003·Granted Feb 20, 2007·4 cites·4 claims
- 0655US6284658B1Manufacturing process for semiconductor waferSHINETSU HANDOTAI KK·Filed 1999·Granted Sep 4, 2001·20 cites·4 claims
- 0752US2007101926A1Method of manufacturing silicon single crystal, silicon single crystal and silicon waferSHINETSU HANDOTAI KK·Filed 2007·Application pending·0 cites
- 0850US6220928B1Surface grinding method and apparatus for thin plate workSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 24, 2001·14 cites·4 claims
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