Inventor · disambiguated record
Hiroshi Seki
Also filed as: SEKI HIROSHI
57 granted patents·7 pending applications·1,524 citations·filing 1974–2022
99Inventor score
Files withSEIKO EPSON CORP15MITSUBISHI ELECTRIC CORP9MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7SEKI HIROSHI6HITACHI LTD4
Top patents by PatentIndex Score
64 records- 0196US7577022B2Electric element, memory device, and semiconductor integrated circuit formed using a state-variable material whose resistance value varies according to an applied pulse voltagePANASONIC CORP·Filed 2005·Granted Aug 18, 2009·56 cites·46 claims
- 0296US5540957AMethod of manufacturing a magnetic recording mediumMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 30, 1996·123 cites·5 claims
- 0394US5637393AMagnetic recording medium and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Jun 10, 1997·63 cites·12 claims
- 0493US7821410B2Radio-type transmitting device, container, transmitting/receiving system and transmitting/receiving methodPANASONIC CORP·Filed 2006·Granted Oct 26, 2010·24 cites·29 claims
- 0593US7525832B2Memory device and semiconductor integrated circuitPANASONIC CORP·Filed 2006·Granted Apr 28, 2009·34 cites·30 claims
- 0693US5121201AMethod and apparatus for detecting the number of personsDAIDO DENKI KOGYO KABUSHIKI KA·Filed 1990·Granted Jun 9, 1992·156 cites·2 claims
- 0790US10811000B2Methods and systems for recognizing simultaneous speech by multiple speakersMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2018·Granted Oct 20, 2020·13 cites·23 claims
- 0889US7982623B2Radio-type transmitting device, container, transmitting/receiving system and transmitting/receiving methodPANASONIC CORP·Filed 2010·Granted Jul 19, 2011·8 cites·10 claims
- 0989US6714031B2Semiconductor device for wafer examinationSEIKO EPSON CORP·Filed 2002·Granted Mar 30, 2004·44 cites·7 claims
- 1088US5712658AInformation presentation apparatus and information display apparatusHITACHI LTD·Filed 1994·Granted Jan 27, 1998·122 cites·13 claims
- 1186US10593321B2Method and apparatus for multi-lingual end-to-end speech recognitionMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2017·Granted Mar 17, 2020·7 cites·18 claims
- 1285US5776602AMagnetic recording medium having a carbon protective film containing nitrogen and oxygen and overcoated with a lubricantMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jul 7, 1998·45 cites·20 claims
- 1383US6188388B1Information presentation apparatus and information display apparatusHITACHI LTD·Filed 1998·Granted Feb 13, 2001·116 cites·12 claims
- 1481US6911612B2SwitchNILES PARTS CO LTD·Filed 2002·Granted Jun 28, 2005·23 cites·7 claims
- 1579US5157478ATape automated bonding packaged semiconductor device incorporating a heat sinkMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·65 cites·23 claims
- 1678US6256875B1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·50 cites·8 claims
- 1776US5835078AInformation presentation apparatus and information display apparatusHITACHI LTD·Filed 1995·Granted Nov 10, 1998·86 cites·13 claims
- 1876US5589263AMagnetic recording medium having a ferromagnetic metal thin film, a dry etched layer, a carbonaceous film, and a lubricant filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Dec 31, 1996·20 cites·25 claims
- 1973US8253449B2Clock switch circuit and clock switch method of the sameSEKI HIROSHI·Filed 2010·Granted Aug 28, 2012·5 cites·11 claims
- 2072US7564288B2Semiconductor integrated circuitSEIKO EPSON CORP·Filed 2006·Granted Jul 21, 2009·8 cites·9 claims
- 2172US5677993AInformation processing apparatus using pointing input and speech inputHITACHI LTD·Filed 1993·Granted Oct 14, 1997·57 cites·12 claims
- 2271US6686550B2SwitchNILES PARTS CO LTD·Filed 2002·Granted Feb 3, 2004·16 cites·7 claims
- 2371US5303120AMethod of manufacturing inversion type IC's and IC module using sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Apr 12, 1994·39 cites·18 claims
- 2471US4640628AComposite fire sensorSEKI HIROSHI·Filed 1985·Granted Feb 3, 1987·42 cites·6 claims
- 2568US6833517B2Multiple switch deviceNILES PARTS CO LTD·Filed 2000·Granted Dec 21, 2004·15 cites·12 claims
- 2667US5309021ASemiconductor device having particular power distribution interconnection arrangementMITSUBISHI ELECTRIC CORP·Filed 1992·Granted May 3, 1994·38 cites·13 claims
- 2766US9875873B2Particle chargerSHIMADZU CORP·Filed 2014·Granted Jan 23, 2018·1 cites·12 claims
- 2866US7350855B2Vehicle water drainage structureNISSAN MOTOR·Filed 2006·Granted Apr 1, 2008·1 cites·17 claims
- 2966US6005289APackage for semiconductor device laminated printed circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 21, 1999·30 cites·5 claims
- 3063US7567111B2Potential fixing circuit for integrated circuit having multiple supply potentialsSEIKO EPSON CORP·Filed 2006·Granted Jul 28, 2009·5 cites·10 claims
- 3163US5494742AMagnetic recording medium having improved running time and corrosion resistanceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Feb 27, 1996·13 cites·15 claims
- 3262US5064706ACarrier tape including molten resin flow path element for resin packaged semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Nov 12, 1991·29 cites·1 claims
- 3360US5798135AMethod for producing a magnetic recording medium having a carbon protective layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 25, 1998·12 cites·12 claims
- 3458US12032474B2Computer-readable recording medium storing acceleration test program, acceleration test method, and acceleration test apparatusFUJITSU LTD·Filed 2022·Granted Jul 9, 2024·0 cites·7 claims
- 3558US7154350B2Semiconductor deviceSEIKO EPSON CORP·Filed 2003·Granted Dec 26, 2006·7 cites·10 claims
- 3657US7656210B2Semiconductor integrated circuitSEIKO EPSON CORP·Filed 2006·Granted Feb 2, 2010·4 cites·7 claims
- 3754US6573751B1Semiconductor device and electronic apparatus using the sameSEIKO EPSON CORP·Filed 2000·Granted Jun 3, 2003·6 cites·20 claims
- 3854US6563335B2Semiconductor device and test method thereforSEIKO EPSON CORP·Filed 2001·Granted May 13, 2003·6 cites·15 claims
- 3954US5496595AMethod for forming film by plasma CVDMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 5, 1996·9 cites·3 claims
- 4054US5099167AVibration wave driven motorCANON KK·Filed 1990·Granted Mar 24, 1992·16 cites·16 claims
- 4152US11378383B2Plant facility apparatus recognition system and plant facility apparatus recognition methodHITACHI GE NUCLEAR ENERGY LTD·Filed 2018·Granted Jul 5, 2022·0 cites·11 claims
- 4252US3947943ACable harness forming machine comprising wire feed-out means in harness laying headNIPPON ELECTRIC CO·Filed 1974·Granted Apr 6, 1976·13 cites·26 claims
- 4351US7126859B2Semiconductor integrated circuit that handles the input/output of a signal with an external circuitSEIKO EPSON CORP·Filed 2004·Granted Oct 24, 2006·4 cites·3 claims
- 4451US6426645B1Semiconductor device that fixes a potential on an input signal wiringSEIKO EPSON CORP·Filed 2000·Granted Jul 30, 2002·5 cites·8 claims
- 4551US2012005103A1Method and apparatus for construction simulationSEKI HIROSHI·Filed 2011·Application pending·0 cites
- 4649US4839713APackage structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·17 cites·4 claims
- 4748US10360315B2Construction field management method and construction field management deviceSEKI HIROSHI·Filed 2011·Granted Jul 23, 2019·0 cites·15 claims
- 4848USRE36077EMethod of manufacturing inversion type IC's and IC module using sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 2, 1999·13 cites·13 claims
- 4946US6292026B1Semiconductor device and electronic apparatus using the sameSEIKO EPSON CORP·Filed 2000·Granted Sep 18, 2001·3 cites·12 claims
- 5046US4639605AFire sensor deviceSEKI HIROSHI·Filed 1984·Granted Jan 27, 1987·13 cites·9 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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