Inventor · disambiguated record
Anthony B. Faraci
Also filed as: FARACI ANTHONY · FARACI ANTHONY B
20 granted patents·3 pending applications·1,431 citations·filing 1988–2020
96Inventor score
Files withTESSERA INC11DUETTO INTEGRATED SYSTEMS INC5FARACI ANTHONY4DALLAS SEMICONDUCTOR2CENTIPEDE SYSTEMS INC1
Top patents by PatentIndex Score
23 records- 0198US6202297B1Socket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1998·Granted Mar 20, 2001·208 cites·8 claims
- 0298US5810609ASocket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1995·Granted Sep 22, 1998·167 cites·26 claims
- 0397US6428328B2Method of making a connection to a microelectronic elementTESSERA INC·Filed 2001·Granted Aug 6, 2002·151 cites·31 claims
- 0496US7491069B1Self-cleaning socket for microelectronic devicesCENTIPEDE SYSTEMS INC·Filed 2008·Granted Feb 17, 2009·68 cites·9 claims
- 0596US6200143B1Low insertion force connector for microelectronic elementsTESSERA INC·Filed 1999·Granted Mar 13, 2001·181 cites·25 claims
- 0696US6086386AFlexible connectors for microelectronic elementsTESSERA INC·Filed 1997·Granted Jul 11, 2000·248 cites·46 claims
- 0795US6374487B1Method of making a connection to a microelectronic elementTESSERA INC·Filed 2000·Granted Apr 23, 2002·86 cites·44 claims
- 0895US5913109AFixtures and methods for lead bonding and deformationTESSERA INC·Filed 1996·Granted Jun 15, 1999·134 cites·19 claims
- 0988US6080603AFixtures and methods for lead bonding and deformationTESSERA INC·Filed 1999·Granted Jun 27, 2000·62 cites·29 claims
- 1086US6286205B1Method for making connections to a microelectronic device having bump leadsTESSERA INC·Filed 1998·Granted Sep 11, 2001·41 cites·30 claims
- 1173US4985870AApparatus for connecting electronic modules containing integrated circuits and backup batteriesDALLAS SEMICONDUCTOR·Filed 1988·Granted Jan 15, 1991·28 cites·11 claims
- 1271US8065121B2Method for pin-less registration of a plurality of laminate elementsFARACI ANTHONY·Filed 2008·Granted Nov 22, 2011·6 cites·2 claims
- 1367US6261863B1Components with releasable leads and methods of making releasable leadsTESSERA INC·Filed 1999·Granted Jul 17, 2001·28 cites·23 claims
- 1466US9282651B2System for manufacturing laminated circuit boardsDUETTO INTEGRATED SYSTEMS INC·Filed 2014·Granted Mar 8, 2016·1 cites·2 claims
- 1566US8594983B2System for manufacturing laminated circuit boardsFARACI ANTHONY·Filed 2011·Granted Nov 26, 2013·1 cites·2 claims
- 1656US8831918B2System for manufacturing laminated circuit boardsFARACI ANTHONY·Filed 2013·Granted Sep 9, 2014·0 cites·3 claims
- 1755US6541845B2Components with releasable leads and methods of making releasable leadsTESSERA INC·Filed 2001·Granted Apr 1, 2003·5 cites·12 claims
- 1852US5144586AApparatus and method for connecting electronic modules containing integrated circuits and backup batteriesDALLAS SEMICONDUCTOR·Filed 1990·Granted Sep 1, 1992·16 cites·12 claims
- 1951US10638615B2System and method for manufacturing flexible laminated circuit boardsDUETTO INTEGRATED SYSTEMS INC·Filed 2015·Granted Apr 28, 2020·0 cites·4 claims
- 2049US2017113296A1Bond head assembly and systemDUETTO INTEGRATED SYSTEMS INC·Filed 2016·Application pending·0 cites
- 2148US2010212945A1Bond head assembly and systemFARACI ANTHONY·Filed 2007·Application pending·0 cites
- 2247US11229126B2System and method for manufacturing flexible laminated circuit boardsDUETTO INTEGRATED SYSTEMS INC·Filed 2020·Granted Jan 18, 2022·0 cites·8 claims
- 2334US2017118880A1Supplemental lighting for reading information on circuit boards for use with a bond head assembly systemDUETTO INTEGRATED SYSTEMS INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →