Inventor

SINGH BHANWAR

US259 patents

⚠️ This page may combine multiple inventors who share the name “SINGH BHANWAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SINGH BHANWAR

ADVANCED MICRO DEVICES INC

Method of forming smaller contact size using a spacer hard mask

Dual damascene process using sacrificial spin-on materials

Monitor CMP process using scatterometry

Critical dimension monitoring from latent image

Bi-layer trim etch process to form integrated circuit gate structures

Use of silicon containing imaging layer to define sub-resolution gate structures

Method of forming integrated circuit features by oxidation of titanium hard mask

Developer soluble dyed BARC for dual damascene process

RELACS process to double the frequency or pitch of small feature formation

Multiple nozzles for dispensing resist

Concurrent measurement of critical dimension and overlay in semiconductor manufacturing

Systems and methods to determine seed layer thickness of trench sidewalls

Topographically aligned layers and method for adjusting the relative alignment of layers and apparatus therefor

Reticle defect printability verification by resist latent image comparison

Scatterometry based measurements of a rotating substrate

Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith

Carbon nanotubes as linewidth standards for SEM &amp; AFM

Multi-pitch and line calibration for mask and wafer CD-SEM system

System and method for facilitating detection of defects on a wafer

Super critical drying of low k materials

Using scatterometry to measure resist thickness and control implant

Method for improving seed layer electroplating for semiconductor

Use of carbon nanotubes as chemical sensors by incorporation of fluorescent molecules within the tube

Method to produce small space pattern using plasma polymerization layer

Use of carbon nanotubes to calibrate conventional tips used in AFM

CVD plasma process to fill contact hole in damascene process

Antireflective siliconoxynitride hardmask layer used during etching processes in integrated circuit fabrication

Post fabrication CD modification on imprint lithography mask

Extraction of tool independent line-edge-roughness (LER) measurements using in-line programmed LER and reliability structures

Use of supercritical fluid to dry wafer and clean lens in immersion lithography

System and method for imprint lithography to facilitate dual damascene integration with two imprint acts

Systems and methods that employ exposure compensation to provide uniform CD control on reticle during fabrication

Using supercritical fluids to clean lenses and monitor defects

System and method for imprint lithography to facilitate dual damascene integration in a single imprint act

Barcode marking of wafer products for inventory control

Dual layer patterning scheme to make dual damascene

Scatterometry and acoustic based active control of thin film deposition process

Scatterometry monitor in cluster process tool environment for advanced process control (APC)

Multi-layer overlay measurement and correction technique for IC manufacturing

Damascene process for a T-shaped gate electrode

Refractive index system monitor and control for immersion lithography

Using scatterometry to detect and control undercut for ARC with developable BARCs

Electrical critical dimension measurement and defect detection for reticle fabrication

Artificial intelligence system for track defect problem solving

Interferometric lithography using reflected light from applied layers

System and method for active control of BPSG deposition

System and method to monitor reticle heating

ADVANCED MICRO DEVICES LLP

Refractive index system monitor and control for immersion lithography

GUPTA SUBHASH

Method of stripping layers of organic materials

GLOBALFOUNDRIES INC

Process margin using discrete assist features

Carbon nanotubes as linewidth standards for SEM & AFM