Inventor
CHAN MIN YU
SG15 patents
⚠️ This page may combine multiple inventors who share the name “CHAN MIN YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
13 patentsUS5952611ASep 14, 1999
Flexible pin location integrated circuit package
TEXAS INSTRUMENTS INC216 citations98
US6137164AOct 24, 2000
Thin stacked integrated circuit device
TEXAS INSTRUMENTS INC326 citations96
US6049129AApr 11, 2000
Chip size integrated circuit package
TEXAS INSTRUMENTS INC108 citations96
US6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6177723B1Jan 23, 2001
Integrated circuit package and flat plate molding process for integrated circuit package
TEXAS INSTRUMENTS INC64 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
US6236107B1May 22, 2001
Encapsulate resin LOC package and method of fabrication
TEXAS INSTRUMENTS INC33 citations92
US6218202B1Apr 17, 2001
Semiconductor device testing and burn-in methodology
TEXAS INSTRUMENTS INC101 citations92
US5647124AJul 15, 1997
Method of attachment of a semiconductor slotted lead to a substrate
TEXAS INSTRUMENTS INC29 citations92
US6468831B2Oct 22, 2002
Method of fabricating thin integrated circuit units
TEXAS INSTRUMENTS INC43 citations90
US6274929B1Aug 14, 2001
Stacked double sided integrated circuit package
TEXAS INSTRUMENTS INC35 citations90
US6040623AMar 21, 2000
Slotted lead for a semiconductor device
TEXAS INSTRUMENTS INC15 citations73