Inventor · disambiguated record
Thomas Bert Gorczyca
Also filed as: DASGUPTA SAMHITA · GORCZYCA THOMAS · GORCZYCA THOMAS B · GORCZYCA THOMAS BERT
60 granted patents·12 pending applications·2,518 citations·filing 1981–2020
99Inventor score
Files withGEN ELECTRIC52GORCZYCA THOMAS BERT4LOCKHEED CORP4MARTIN MARIETTA CORP3BEAUPRE RICHARD ALFRED2
Top patents by PatentIndex Score
72 records- 0197US6396153B2Circuit chip package and fabrication methodGEN ELECTRIC·Filed 2001·Granted May 28, 2002·163 cites·10 claims
- 0297US5703400AFabrication and structures of two-sided molded circuit modules with flexible interconnect layersGEN ELECTRIC·Filed 1996·Granted Dec 30, 1997·212 cites·9 claims
- 0397US5472539AMethods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated componentsGEN ELECTRIC·Filed 1994·Granted Dec 5, 1995·137 cites·10 claims
- 0496US6242282B1Circuit chip package and fabrication methodGEN ELECTRIC·Filed 1999·Granted Jun 5, 2001·198 cites·20 claims
- 0596US5161093AMultiple lamination high density interconnect process and structure employing a variable crosslinking adhesiveGEN ELECTRIC·Filed 1990·Granted Nov 3, 1992·246 cites·19 claims
- 0695US6800373B2Epoxy resin compositions, solid state devices encapsulated therewith and methodGEN ELECTRIC·Filed 2002·Granted Oct 5, 2004·101 cites·66 claims
- 0795US5757072AStructure for protecting air bridges on semiconductor chips from damageMARTIN MARIETTA CORP·Filed 1996·Granted May 26, 1998·169 cites·9 claims
- 0895US5546654AVacuum fixture and method for fabricating electronic assembliesGEN ELECTRIC·Filed 1994·Granted Aug 20, 1996·187 cites·23 claims
- 0991US5567657AFabrication and structures of two-sided molded circuit modules with flexible interconnect layersGEN ELECTRIC·Filed 1995·Granted Oct 22, 1996·107 cites·8 claims
- 1088US6368410B1Semiconductor processing articleGEN ELECTRIC·Filed 1999·Granted Apr 9, 2002·82 cites·14 claims
- 1187US7776236B2Index contrast enhanced optical waveguides and fabrication methodsGEN ELECTRIC·Filed 2003·Granted Aug 17, 2010·34 cites·30 claims
- 1287US6977057B2Embossing processGEN ELECTRIC·Filed 2002·Granted Dec 20, 2005·24 cites·28 claims
- 1386US7400809B2Optical waveguide devices and method of making the sameGEN ELECTRIC·Filed 2004·Granted Jul 15, 2008·33 cites·38 claims
- 1486US5302547ASystems for patterning dielectrics by laser ablationGEN ELECTRIC·Filed 1993·Granted Apr 12, 1994·98 cites·2 claims
- 1585US6548189B1Epoxy adhesiveGEN ELECTRIC·Filed 2001·Granted Apr 15, 2003·48 cites·18 claims
- 1684US7018572B2Method for producing data storage mediaGEN ELECTRIC·Filed 2001·Granted Mar 28, 2006·21 cites·17 claims
- 1784US6533968B1Structure and method for molding optical disksGEN ELECTRIC·Filed 2000·Granted Mar 18, 2003·15 cites·14 claims
- 1883US6284564B1HDI chip attachment method for reduced processingLOCKHEED CORP·Filed 1999·Granted Sep 4, 2001·71 cites·4 claims
- 1983US4728697ANovel copolyamideimides, prepolymers therefor and method for their preparationGEN ELECTRIC·Filed 1985·Granted Mar 1, 1988·31 cites·16 claims
- 2081US5561085AStructure for protecting air bridges on semiconductor chips from damageMARTIN MARIETTA CORP·Filed 1994·Granted Oct 1, 1996·56 cites·8 claims
- 2178US6715200B2Methods for making data storage mediaGEN ELECTRIC·Filed 2001·Granted Apr 6, 2004·9 cites·22 claims
- 2278US4433131ACoating solution of polyetherimide monomersGEN ELECTRIC·Filed 1981·Granted Feb 21, 1984·30 cites·19 claims
- 2377US9929319B2LED package with red-emitting phosphorsGEN ELECTRIC·Filed 2014·Granted Mar 27, 2018·4 cites·8 claims
- 2477US8310040B2Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereofBEAUPRE RICHARD ALFRED·Filed 2010·Granted Nov 13, 2012·4 cites·11 claims
- 2577US6602739B1Method for making multichip module substrates by encapsulating electrical conductors and filling gapsLOCKHEED CORP·Filed 2002·Granted Aug 5, 2003·25 cites·6 claims
- 2676US5300812APlasticized polyetherimide adhesive composition and usageGEN ELECTRIC·Filed 1992·Granted Apr 5, 1994·53 cites·11 claims
- 2775US8586421B2Method of forming semiconductor device package having high breakdown voltage and low parasitic inductanceBEAUPRE RICHARD ALFRED·Filed 2012·Granted Nov 19, 2013·3 cites·20 claims
- 2875US6935792B2Optoelectronic package and fabrication methodGEN ELECTRIC·Filed 2002·Granted Aug 30, 2005·21 cites·66 claims
- 2975US6787071B2Method and apparatus for producing data storage mediaGEN ELECTRIC·Filed 2001·Granted Sep 7, 2004·10 cites·42 claims
- 3074US6508961B1Structure and method for molding optical disksGEN ELECTRIC·Filed 2000·Granted Jan 21, 2003·8 cites·9 claims
- 3174US6303193B1Process for fabricating a tool used in electrochemical machiningGEN ELECTRIC·Filed 1998·Granted Oct 16, 2001·30 cites·19 claims
- 3273US5492586AMethod for fabricating encased molded multi-chip module substrateMARTIN MARIETTA CORP·Filed 1994·Granted Feb 20, 1996·47 cites·16 claims
- 3372US7541391B2Self-forming polymer waveguide and waveguide material with reduced shrinkageGEN ELECTRIC·Filed 2005·Granted Jun 2, 2009·1 cites·25 claims
- 3470US4533504AProcess for the preparation of diaryl carbonatesGEN ELECTRIC·Filed 1982·Granted Aug 6, 1985·9 cites·7 claims
- 3569US8431444B2Epoxy encapsulating and lamination adhesive and method of making sameGORCZYCA THOMAS BERT·Filed 2011·Granted Apr 30, 2013·2 cites·20 claims
- 3669US6255137B1Method for making air pockets in an HDI contextLOCKHEED CORP·Filed 1999·Granted Jul 3, 2001·36 cites·20 claims
- 3768US8427845B2Electrical connectors for optoelectronic device packagingGORCZYCA THOMAS BERT·Filed 2010·Granted Apr 23, 2013·2 cites·20 claims
- 3865US7018580B2Method and apparatus for forming tapered waveguide structuresGEN ELECTRIC·Filed 2002·Granted Mar 28, 2006·6 cites·10 claims
- 3965US6706205B2Semiconductor processing articleGEN ELECTRIC·Filed 2002·Granted Mar 16, 2004·7 cites·16 claims
- 4065US4374972ACoating solution of polyetherimide oligomersGEN ELECTRIC·Filed 1981·Granted Feb 22, 1983·16 cites·20 claims
- 4164US4360633ACoating solution of polyetherimide oligomersGEN ELECTRIC·Filed 1981·Granted Nov 23, 1982·18 cites·9 claims
- 4263US6706624B1Method for making multichip module substrates by encapsulating electrical conductorsLOCKHEED CORP·Filed 2002·Granted Mar 16, 2004·11 cites·6 claims
- 4361US6146558AStructure and method for molding optical disksGEN ELECTRIC·Filed 1998·Granted Nov 14, 2000·15 cites·10 claims
- 4459US2008201937A1Methods for Making Data Storage Media and the Resultant MediaGEN ELECTRIC·Filed 2007·Application pending·0 cites
- 4559US2020161442A1Systems and methods for in-situ doped semiconductor gate electrodes for wide bandgap semiconductor power devicesGEN ELECTRIC·Filed 2020·Application pending·0 cites
- 4658US6067931AThermal processor for semiconductor wafersGEN ELECTRIC·Filed 1996·Granted May 30, 2000·26 cites·21 claims
- 4757US7956457B2System and apparatus for venting electronic packages and method of making sameGEN ELECTRIC·Filed 2008·Granted Jun 7, 2011·1 cites·23 claims
- 4856US8691371B2Barrier coating and methodKIM TAE WON·Filed 2007·Granted Apr 8, 2014·1 cites·29 claims
- 4956US6504233B1Semiconductor processing componentGEN ELECTRIC·Filed 1999·Granted Jan 7, 2003·18 cites·20 claims
- 5055US5169911AHeat curable blends of silicone polymide and epoxy resinGEN ELECTRIC·Filed 1992·Granted Dec 8, 1992·22 cites·5 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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