P

Inventor

MATSUDA TETSUO

JP62 patents
⚠️ This page may combine multiple inventors who share the name “MATSUDA TETSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOSHIBA KK

38 patents
US6251763B1Jun 26, 2001

Semiconductor device and method for manufacturing same

TOSHIBA KK114 citations99
US5413967AMay 9, 1995

Method of manufacturing semiconductor devices

TOSHIBA KK292 citations99
US6563308B2May 13, 2003

Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium

TOSHIBA KK144 citations98
US6375823B1Apr 23, 2002

Plating method and plating apparatus

TOSHIBA KK96 citations98
US6348402B1Feb 19, 2002

Method of manufacturing a copper interconnect

TOSHIBA KK87 citations98
US6229211B1May 8, 2001

Semiconductor device and method of manufacturing the same

TOSHIBA KK88 citations98
US6403481B1Jun 11, 2002

Film formation method

TOSHIBA KK55 citations96
US6291891B1Sep 18, 2001

Semiconductor device manufacturing method and semiconductor device

TOSHIBA KK69 citations96
US6150270ANov 21, 2000

Method for forming barrier layer for copper metallization

TOSHIBA KK54 citations96
US5998100ADec 7, 1999

Fabrication process using a multi-layer antireflective layer

TOSHIBA KK89 citations96
US5759746AJun 2, 1998

Fabrication process using a thin resist

TOSHIBA KK75 citations96
US5679610AOct 21, 1997

Method of planarizing a semiconductor workpiece surface

TOSHIBA KK59 citations96
US5132756AJul 21, 1992

Method of manufacturing semiconductor devices

TOSHIBA KK78 citations96
US4866009ASep 12, 1989

Multilayer wiring technique for a semiconductor device

TOSHIBA KK55 citations96
US6913681B2Jul 5, 2005

Plating method and plating apparatus

TOSHIBA KK20 citations93
US6787827B2Sep 7, 2004

Semiconductor device and method for manufacturing the same

TOSHIBA KK30 citations93
US6611060B1Aug 26, 2003

Semiconductor device having a damascene type wiring layer

TOSHIBA KK26 citations93
US6579785B2Jun 17, 2003

Method of making multi-level wiring in a semiconductor device

TOSHIBA KK31 citations93
US6342444B1Jan 29, 2002

Method of forming diffusion barrier for copper interconnects

TOSHIBA KK32 citations93
US6333215B1Dec 25, 2001

Method for manufacturing a semiconductor device

TOSHIBA KK31 citations93
US5094879AMar 10, 1992

Method of activating at least one gas to produce different charged species, selecting specific species, decelerating the species, and chemically reacting the species to form a thin film

TOSHIBA KK24 citations93
US4923715AMay 8, 1990

Method of forming thin film by chemical vapor deposition

TOSHIBA KK50 citations93
US7595530B2Sep 29, 2009

Power semiconductor device with epitaxially-filled trenches

TOSHIBA KK12 citations92
US6518177B1Feb 11, 2003

Method of manufacturing a semiconductor device

TOSHIBA KK23 citations92
US6368951B2Apr 9, 2002

Semiconductor device manufacturing method and semiconductor device

TOSHIBA KK16 citations92
US7420245B2Sep 2, 2008

Semiconductor device and method of manufacturing the same

TOSHIBA KK12 citations84
US7214305B2May 8, 2007

Method of manufacturing electronic device

TOSHIBA KK12 citations84
US9947751B2Apr 17, 2018

Semiconductor device and method of manufacturing the same

TOSHIBA KK6 citations82
US6764585B2Jul 20, 2004

Electronic device manufacturing method

TOSHIBA KK8 citations74
US6750143B1Jun 15, 2004

Method for forming a plating film, and device for forming the same

TOSHIBA KK7 citations74
US6632476B2Oct 14, 2003

Substrate processing method and substrate processing apparatus

TOSHIBA KK8 citations74
US6403997B1Jun 11, 2002

Method for manufacturing semiconductor devices

TOSHIBA KK11 citations74
US5958630ASep 28, 1999

Phase shifting mask and method of manufacturing the same

TOSHIBA KK13 citations74
US5658389AAug 19, 1997

Thin film forming method and apparatus

TOSHIBA KK9 citations74
US7936015B2May 3, 2011

Semiconductor device having trenches filled with a semiconductor having an impurity concentration gradient

TOSHIBA KK2 citations63
US7898031B2Mar 1, 2011

Semiconductor device with tapered trenches and impurity concentration gradients

TOSHIBA KK3 citations63
US7575664B2Aug 18, 2009

Plating method

TOSHIBA KK3 citations63
US6998342B2Feb 14, 2006

Electronic device manufacturing method

TOSHIBA KK2 citations63

TOYO JOZO KK

7 patents

EBARA CORP

3 patents

IBM

1 patent

IMAMURA TOMOMI

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.