Inventor

TSAI CHUNG-CHE

TW17 patents

⚠️ This page may combine multiple inventors who share the name “TSAI CHUNG-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI CHUNG-CHE

ULTRATERA CORP

Stacked chip package with enhanced thermal conductivity

Double-sided thermally enhanced IC chip package

Low profile stack semiconductor package

Low profile stack semiconductor package

Bonding pads of printed circuit board capable of holding solder balls securely

Mold structure for package fabrication

Semiconductor package and method for fabricating the same

Fabrication method of circuit board

TSAI SHIANN TSONG

Semiconductor package and fabrication method thereof

Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance

Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding

Semiconductor package with in-package compartmental shielding and fabrication method thereof

ULTRA TERA CORP

Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package

Light sensitive semiconductor package and fabrication method thereof

Fabrication method for circuit board

UNITED TEST CT INC

Low profile semiconductor package and process for making the same

TSAI CHUNG CHE

Semiconductor package with in-package compartmental shielding and fabrication method thereof