Inventor

PREUSSE AXEL

DE30 patents

⚠️ This page may combine multiple inventors who share the name “PREUSSE AXEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PREUSSE AXEL

ADVANCED MICRO DEVICES INC

Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst

Method of forming metal lines having improved uniformity on a substrate

Technique for electrochemically depositing an alloy having a chemical order

Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime

Method and system for controlling ion distribution during plating of a metal on a workpiece surface

Method of forming reliable copper interconnects with improved hole filling

Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process

Apparatus and method for treating a substrate electrochemically while reducing metal corrosion

Methods and apparatus for forming a copper interconnect

Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase

Method of reducing wafer contamination by removing under-metal layers at the wafer edge

Method and system for improving the manufacturing of metal damascene structures

Apparatus and method for electrochemical metal deposition

Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity

Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient

Method of reworking a semiconductor structure

Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices

Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process

Apparatus and method for removing bubbles from a process liquid

GLOBALFOUNDRIES INC

Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

Semiconductor structure including a layer of a first metal between a diffusion barrier layer and a second metal and method for the formation thereof

Apparatus and method for removing bubbles from a process liquid

Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces

SEIDEL ROBERT

Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines

Contact elements of semiconductor devices formed on the basis of a partially applied activation layer

AMD

Apparatus for forming a copper interconnect

NOPPER MARKUS

Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices

PREUSSE AXEL

Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces

AUBEL OLIVER

Providing superior electromigration performance and reducing deterioration of sensitive low-k dielectrics in metallization systems of semiconductor devices