Inventor
SISSENSTEIN JR DAVID W
US7 patents
Patents
7 patentsUS5241454AAug 31, 1993
Mutlilayered flexible circuit package
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US5321884AJun 21, 1994
Multilayered flexible circuit package
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US5145104ASep 8, 1992
Substrate soldering in a reducing atmosphere
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US5028984AJul 2, 1991
Epoxy composition and use thereof
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US4919729AApr 24, 1990
Solder paste for use in a reducing atmosphere
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US5190595AMar 2, 1993
Ozone safe stripping solution for thermal grease
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US4632295ADec 30, 1986
Reduction atmosphere workpiece joining
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