Epoxy composition and use thereof

Abstract

A curable composition containing an epoxide component and zinc oxide and use thereof.

What we claim as new and desire to secure by Letters Patent is: 
     
       1. A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and   b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.     
     
     
       2. The composition of claim 1 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin. 
     
     
       3. The composition of claim 1 wherein said anhydride is nadic methyl anhydride or a phthalic anhydride. 
     
     
       4. The composition of claim 1 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride. 
     
     
       5. An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and   b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.     
     
     
       6. The module of claim 5 wherein said substrate is a polyimide. 
     
     
       7. The module of claim 5 wherein said heat sink is selected from the group consisting of aluminum, anodized aluminum, nickel plated copper, bright tin plated copper, benzotriazole treated copper, and copper/Invar/copper. 
     
     
       8. The module of claim 5 wherein said heat sink is aluminum. 
     
     
       9. The module of claim 5 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin and said hardener in an anhydride. 
     
     
       10. An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a curved composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and   b) zinc oxide; wherein the amount of said zinc oxide is about 50% to about 70% by weight of the total of the zinc oxide and epoxide component; and wherein said epoxide component contains about 45% to about 65% by weight of epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.     
     
     
       11. The module of claim 10 wherein said carrier is a ceramic substrate. 
     
     
       12. The module of claim 10 wherein said cap is aluminum. 
     
     
       13. The module of claim 10 wherein said epoxy polymer is a diglycidyl ether of bisphenol A-epichlorohydrin and said hardener in an anhydride. 
     
     
       14. The module of claim 5 wherein said anhydride anhydride is nadic methyl anhydride or a phthalic anhydride. 
     
     
       15. The module of claim 5 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride. 
     
     
       16. The module of claim 10 wherein said anhydride is nadic methyl anhydride or a phthalic anhydride. 
     
     
       17. The module of claim 10 wherein said anhydride is hexahydrophthalic anhydride or tetrahydrophthalic anhydride. 
     
     
       18. The composition of claim 1 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns. 
     
     
       19. The module of claim 5 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns. 
     
     
       20. The module of claim 10 wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns. 
     
     
       21. A curable composition containing: a) an epoxide component that includes an epoxy polymer and hardening component; and   b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1;   and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 35% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol, and about 0.85% to about 1% by weight of a tertiary amine.     
     
     
       22. An integrated circuit module containing a flexible substrate and having attached to one major surface thereof at least one integrated circuit chip wherein said at least one integrated circuit chip is connected to a heat sink by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and   b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1;   and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.     
     
     
       23. An integrated circuit module which comprises an integrated circuit carrier having a/an integrated circuit chip(s) bonded thereto, a cap covering said integrated circuit chip(s) for protection against exposure to the surrounding atmosphere, and wherein said carrier is bonded to said cap by a cured composition from: a) an epoxide component that includes an epoxy polymer and hardening agent; and   b) zinc oxide wherein said zinc oxide is spherical having a particle size wherein at least about 70% of the particles are 1-4 microns and over 90% are 1-10 microns; wherein the relative amount of said zinc oxide to said epoxide component is about 1:4 to about 2:1;   and wherein said epoxide component contains about 45% to about 65% by weight of the epoxy; about 34% to about 54% by weight of a combination of hardener and flexibilizer portion wherein said portion contains about 15% to about 49% by weight of anhydride and about 40% to about 85% by weight of polyalkylene glycol or polyoxyalkylene glycol and about 0.85% to about 1% by weight of a tertiary amine.