Inventor · disambiguated record
Joseph Funari
Also filed as: FUNARI JOSEPH
28 granted patents·2,355 citations·filing 1976–1998
98Inventor score
Files withIBM28
Top patents by PatentIndex Score
28 records- 0196US5241454AMutlilayered flexible circuit packageIBM·Filed 1992·Granted Aug 31, 1993·222 cites·13 claims
- 0295US5203075AMethod of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different soldersIBM·Filed 1991·Granted Apr 20, 1993·313 cites·9 claims
- 0395US5109318APluggable electronic circuit package assembly with snap together heat sink housingIBM·Filed 1990·Granted Apr 28, 1992·233 cites·36 claims
- 0495US4171477AMicro-surface weldingIBM·Filed 1976·Granted Oct 16, 1979·97 cites·4 claims
- 0592US5715144AMulti-layer, multi-chip pyramid and circuit board structureIBM·Filed 1996·Granted Feb 3, 1998·149 cites·13 claims
- 0691US5907903AMulti-layer-multi-chip pyramid and circuit board structure and method of forming sameIBM·Filed 1998·Granted Jun 1, 1999·129 cites·11 claims
- 0791US5261155AMethod for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different soldersIBM·Filed 1993·Granted Nov 16, 1993·145 cites·8 claims
- 0891US4294729AComposition containing alcohol and use thereof for epoxy removalIBM·Filed 1979·Granted Oct 13, 1981·48 cites·42 claims
- 0989US4849856AElectronic package with improved heat sinkIBM·Filed 1988·Granted Jul 18, 1989·103 cites·17 claims
- 1088US5744759ACircuit boards that can accept a pluggable tab module that can be attached or removed without solderIBM·Filed 1996·Granted Apr 28, 1998·102 cites·11 claims
- 1186US5859470AInterconnection of a carrier substrate and a semiconductor deviceIBM·Filed 1992·Granted Jan 12, 1999·51 cites·3 claims
- 1285US5920125AInterconnection of a carrier substrate and a semiconductor deviceIBM·Filed 1997·Granted Jul 6, 1999·49 cites·13 claims
- 1384US5435732AFlexible circuit memberIBM·Filed 1994·Granted Jul 25, 1995·75 cites·12 claims
- 1484US5222649AApparatus for soldering a semiconductor device to a circuitized substrateIBM·Filed 1992·Granted Jun 29, 1993·80 cites·7 claims
- 1584US5003429AElectronic assembly with enhanced heat sinkingIBM·Filed 1990·Granted Mar 26, 1991·60 cites·17 claims
- 1683US5565119AMethod and apparatus for soldering with a multiple tip and associated optical fiber heating deviceIBM·Filed 1995·Granted Oct 15, 1996·61 cites·15 claims
- 1782US5553769AInterconnection of a carrier substrate and a semiconductor deviceIBM·Filed 1995·Granted Sep 10, 1996·57 cites·12 claims
- 1878US5207372AMethod for soldering a semiconductor device to a circuitized substrateIBM·Filed 1991·Granted May 4, 1993·60 cites·17 claims
- 1977US5321884AMultilayered flexible circuit packageIBM·Filed 1993·Granted Jun 21, 1994·50 cites·10 claims
- 2077US4392617ASpray head apparatusIBM·Filed 1981·Granted Jul 12, 1983·41 cites·5 claims
- 2174US4670325AStructure containing a layer consisting of a polyimide and an organic filled and method for producing such a structureIBM·Filed 1986·Granted Jun 2, 1987·44 cites·7 claims
- 2269US4434134APinned ceramic substrateIBM·Filed 1981·Granted Feb 28, 1984·30 cites·7 claims
- 2364US5211328AMethod of applying solderIBM·Filed 1992·Granted May 18, 1993·33 cites·20 claims
- 2464US5057969AThin film electronic deviceIBM·Filed 1990·Granted Oct 15, 1991·36 cites·8 claims
- 2561US5028984AEpoxy composition and use thereofIBM·Filed 1988·Granted Jul 2, 1991·27 cites·23 claims
- 2660US6070785AProcess for manufacturing boards that can accept a pluggable tab module that can be attached or removed without solderIBM·Filed 1998·Granted Jun 6, 2000·23 cites·8 claims
- 2755US5115964AMethod for bonding thin film electronic deviceIBM·Filed 1991·Granted May 26, 1992·25 cites·14 claims
- 2842US5190595AOzone safe stripping solution for thermal greaseIBM·Filed 1991·Granted Mar 2, 1993·12 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →