Inventor · disambiguated record
Bahgat Sammakia
Also filed as: SAMMAKIA BAHGAT · SAMMAKIA BAHGAT G · SAMMAKIA BAHGAT GHALEB
29 granted patents·3 pending applications·1,327 citations·filing 1988–2024
97Inventor score
Top patents by PatentIndex Score
32 records- 0197US11076509B2Control systems and prediction methods for it cooling performance in containmentUNIV NEW YORK STATE RES FOUND·Filed 2018·Granted Jul 27, 2021·206 cites·20 claims
- 0296US4914551AElectronic package with heat spreader memberIBM·Filed 1988·Granted Apr 3, 1990·203 cites·19 claims
- 0395US10308856B1Pastes for thermal, electrical and mechanical bondingUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Jun 4, 2019·19 cites·20 claims
- 0495US5109318APluggable electronic circuit package assembly with snap together heat sink housingIBM·Filed 1990·Granted Apr 28, 1992·233 cites·36 claims
- 0593US8518304B1Nano-structure enhancements for anisotropic conductive material and thermal interposersSAMMAKIA BAHGAT·Filed 2010·Granted Aug 27, 2013·24 cites·20 claims
- 0693US5420520AMethod and apparatus for testing of integrated circuit chipsIBM·Filed 1993·Granted May 30, 1995·128 cites·3 claims
- 0791US12363865B2Regenerative preheater for phase change cooling applicationsUNIV NEW YORK STATE RES FOUND·Filed 2023·Granted Jul 15, 2025·4 cites·20 claims
- 0891US5491610AElectronic package having active means to maintain its operating temperature constantIBM·Filed 1994·Granted Feb 13, 1996·131 cites·10 claims
- 0989US4849856AElectronic package with improved heat sinkIBM·Filed 1988·Granted Jul 18, 1989·103 cites·17 claims
- 1084US11876036B2Fluid cooling system including embedded channels and cold platesUNIV NEW YORK STATE RES FOUND·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 1184US5003429AElectronic assembly with enhanced heat sinkingIBM·Filed 1990·Granted Mar 26, 1991·60 cites·17 claims
- 1281US8685529B1Surface coating for electronic systemsCHO JUNGHYUN·Filed 2012·Granted Apr 1, 2014·4 cites·20 claims
- 1377US8129001B2Composite thermal interface material system and method using nano-scale componentsWANG HAO HOWARD·Filed 2009·Granted Mar 6, 2012·11 cites·27 claims
- 1476US8882983B2Embedded thin filmsCHO JUNGHYUN·Filed 2009·Granted Nov 11, 2014·1 cites·31 claims
- 1576US8481103B1Method and pattern of dispensing thermal interface materialsDAVIDSON DREW A·Filed 2009·Granted Jul 9, 2013·10 cites·22 claims
- 1675US7645512B1Nano-structure enhancements for anisotropic conductive adhesive and thermal interposersRES FOUNDATION OF THE STATE UN·Filed 2003·Granted Jan 12, 2010·17 cites·34 claims
- 1772US9017808B2Composite thermal interface material system and method using nano-scale componentsWANG HAO·Filed 2009·Granted Apr 28, 2015·11 cites·29 claims
- 1868US8277112B2Devices and fluid flow methods for improving mixingBHOPTE SIDDHARTH·Filed 2009·Granted Oct 2, 2012·4 cites·10 claims
- 1967US5870285AAssembly mounting techniques for heat sinks in electronic packagingIBM·Filed 1996·Granted Feb 9, 1999·35 cites·5 claims
- 2066US7282254B1Surface coating for electronic systemsUNIV NEW YORK STATE RES FOUND·Filed 2004·Granted Oct 16, 2007·14 cites·39 claims
- 2166US5912800AElectronic packages and method to enhance the passive thermal management of electronic packagesIBM·Filed 1997·Granted Jun 15, 1999·32 cites·16 claims
- 2263US8173260B1Nano-structure enhancements for anisotropic conductive adhesive and thermal interposersSAMMAKIA BAHGAT·Filed 2010·Granted May 8, 2012·1 cites·22 claims
- 2363US2023247795A1Regenerative preheater for phase change cooling applicationsUNIV NEW YORK STATE RES FOUND·Filed 2022·Application pending·0 cites
- 2461US10064283B2Embedded thin filmsUNIV NEW YORK STATE RES FOUND·Filed 2014·Granted Aug 28, 2018·0 cites·20 claims
- 2561US5028984AEpoxy composition and use thereofIBM·Filed 1988·Granted Jul 2, 1991·27 cites·23 claims
- 2659US2024082920A1Thermal stress and substrate damage reducing additive manufacturing methodUNIV NEW YORK STATE RES FOUND·Filed 2023·Application pending·0 cites
- 2758US5966290AElectronic packages and a method to improve thermal performance of electronic packagesINTERNATIONAL BUSINESS MACHIN·Filed 1997·Granted Oct 12, 1999·23 cites·6 claims
- 2853US6219234B1Method for using pulsating flow to improve thermal transport in systemsIBM·Filed 1999·Granted Apr 17, 2001·11 cites·26 claims
- 2952US2024341057A1Liquid cooled multi-chip cold platesUNIV NEW YORK STATE RES FOUND·Filed 2024·Application pending·0 cites
- 3050US6058015AElectronic packages and a method to improve thermal performance of electronic packagesIBM·Filed 1999·Granted May 2, 2000·13 cites·6 claims
- 3147US8851159B1Method and pattern of dispensing thermal interface materialsDAVIDSON DREW A·Filed 2009·Granted Oct 7, 2014·0 cites·23 claims
- 3247US8158201B1Method of manufacturing surface coatings for electronic systemsCHO JUNGHYUN·Filed 2007·Granted Apr 17, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →