Inventor

LIU FENG Q

US70 patents

⚠️ This page may combine multiple inventors who share the name “LIU FENG Q”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU FENG Q

APPLIED MATERIALS INC

Electrolyte composition and treatment for electrolytic chemical mechanical polishing

Method and apparatus for face-up substrate polishing

Methods for pre-cleaning conductive interconnect structures

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Conductive polishing article for electrochemical mechanical polishing

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Barrier removal at low polish pressure

Pad assembly for electrochemical mechanical processing

Conductive polishing article for electrochemical mechanical polishing

Method for chemical mechanical polishing of semiconductor substrates

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Hydrogen bubble reduction on the cathode using double-cell designs

Method and composition for polishing a substrate

Method and composition for polishing a substrate

Biased retaining ring

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

Conductive polishing article for electrochemical mechanical polishing

Full sequence metal and barrier layer electrochemical mechanical processing

Control of removal profile in electrochemically assisted CMP

Pad assembly for electrochemical mechanical processing

Methods for thermally forming a selective cobalt layer

Alcohol assisted ALD film deposition

Precursors of manganese and manganese-based compounds for copper diffusion barrier layers and methods of use

Molybdenum(0) precursors for deposition of molybdenum films

Methods for depositing metallic iridium and iridium silicide

Method and apparatus for reduced wear polishing pad conditioning

Methods for selective dry etching gallium oxide

Water assisted highly pure ruthenium thin film deposition

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Dual reduced agents for barrier removal in chemical mechanical polishing

Benzyl compound passivation for selective deposition and selective etch protection

Method of depositing metal films

Low temperature deposition of iridium containing films

Electronic device having an oxygen free platinum group metal film

Molybdenum thin films by oxidation-reduction

Low temperature deposition of iridium containing films

Oxygen free deposition of platinum group metal films

Chlorine-free removal of molybdenum oxides from substrates

Molybdenum(0) precursors for deposition of molybdenum films

Molybdenum(VI) precursors for deposition of molybdenum films

Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnect

Method and composition for electrochemical mechanical polishing processing

Method to deposit metal cap for interconnect

WESTERN DIGITAL TECHNOLOGIES INC

MAMR writer with low resistance MAMR stack

WESTERN DIGITAL TECH INC

MAMR writer with low resistance MAMR stack

WANG YOU

Chemical planarization of copper wafer polishing