Inventor · disambiguated record
Maurice S. Karpman
Also filed as: KARPMAN MAURICE · KARPMAN MAURICE S · KARPMAN MAURICE SAMUEL
34 granted patents·4 pending applications·1,155 citations·filing 1988–2017
98Inventor score
Files withANALOG DEVICES INC18CHARLES STARK DRAPER LABORATORY INC8MOTOROLA INC3DRAPER LAB CHARLES S2PRIME COMPUTER INC2
Top patents by PatentIndex Score
38 records- 0197US6828674B2Hermetically sealed microstructure packageANALOG DEVICES INC·Filed 2002·Granted Dec 7, 2004·158 cites·49 claims
- 0297US6448109B1Wafer level method of capping multiple MEMS elementsANALOG DEVICES INC·Filed 2000·Granted Sep 10, 2002·145 cites·16 claims
- 0397US6441481B1Hermetically sealed microstructure packageANALOG DEVICES INC·Filed 2000·Granted Aug 27, 2002·134 cites·9 claims
- 0492US6555904B1Electrically shielded glass lid for a packaged deviceANALOG DEVICES INC·Filed 2001·Granted Apr 29, 2003·71 cites·31 claims
- 0592US6534340B1Cover cap for semiconductor wafer devicesANALOG DEVICES INC·Filed 1998·Granted Mar 18, 2003·149 cites·36 claims
- 0690US6508561B1Optical mirror coatings for high-temperature diffusion barriers and mirror shapingANALOG DEVICES INC·Filed 2001·Granted Jan 21, 2003·59 cites·19 claims
- 0789US4825337ACircuit board thermal contact devicePRIME COMPUTER INC·Filed 1988·Granted Apr 25, 1989·61 cites·32 claims
- 0886US6686993B1Probe card for testing optical micro electromechanical system devices at wafer levelANALOG DEVICES INC·Filed 2001·Granted Feb 3, 2004·57 cites·43 claims
- 0984US7608534B2Interconnection of through-wafer vias using bridge structuresANALOG DEVICES INC·Filed 2005·Granted Oct 27, 2009·13 cites·20 claims
- 1083US10681821B2Methods and devices for improved space utilization in wafer based modulesCHARLES STARK DRAPER LABORATORY INC·Filed 2014·Granted Jun 9, 2020·5 cites·8 claims
- 1183US9735128B2Method for incorporating stress sensitive chip scale components into reconstructed wafer based modulesCHARLES STARK DRAPER LABORATORY INC·Filed 2014·Granted Aug 15, 2017·6 cites·7 claims
- 1283US7166911B2Packaged microchip with premolded-type packageANALOG DEVICES INC·Filed 2004·Granted Jan 23, 2007·42 cites·21 claims
- 1382US6946742B2Packaged microchip with isolator having selected modulus of elasticityANALOG DEVICES INC·Filed 2002·Granted Sep 20, 2005·31 cites·13 claims
- 1478US9257355B2Method for embedding a chipset having an intermediary interposer in high density electronic modulesDRAPER LAB CHARLES S·Filed 2014·Granted Feb 9, 2016·4 cites·7 claims
- 1578US5117279ASemiconductor device having a low temperature uv-cured epoxy sealMOTOROLA INC·Filed 1990·Granted May 26, 1992·59 cites·3 claims
- 1674US9941223B2Devices and methods for detecting counterfeit semiconductor devicesCHARLES STARK DRAPER LABORATORY INC·Filed 2015·Granted Apr 10, 2018·2 cites·14 claims
- 1772US6713829B1Single unit position sensorANALOG DEVICES INC·Filed 2003·Granted Mar 30, 2004·25 cites·21 claims
- 1869US9847230B2Method and apparatus for using universal cavity wafer in wafer level packagingCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Dec 19, 2017·1 cites·8 claims
- 1969US5657165AApparatus and method for generating full-color images using two light sourcesREFLECTION TECHNOLOGY INC·Filed 1995·Granted Aug 12, 1997·41 cites·28 claims
- 2068US7416984B2Method of producing a MEMS deviceANALOG DEVICES INC·Filed 2004·Granted Aug 26, 2008·12 cites·4 claims
- 2162US6964882B2Fabricating complex micro-electromechanical systems using a flip bonding techniqueANALOG DEVICES INC·Filed 2002·Granted Nov 15, 2005·11 cites·9 claims
- 2262US6933163B2Fabricating integrated micro-electromechanical systems using an intermediate electrode layerANALOG DEVICES INC·Filed 2002·Granted Aug 23, 2005·14 cites·7 claims
- 2360US5134364AElastomeric test probePRIME COMPUTER INC·Filed 1990·Granted Jul 28, 1992·20 cites·36 claims
- 2458US5289032ATape automated bonding(tab)semiconductor device and method for making the sameMOTOROLA INC·Filed 1991·Granted Feb 22, 1994·23 cites·12 claims
- 2552US2008225505A1Method of producing a MEMS deviceANALOG DEVICES INC·Filed 2008·Application pending·0 cites
- 2651US10418249B2Method and apparatus for using universal cavity wafer in wafer level packagingCHARLES STARK DRAPER LABORATORY INC·Filed 2017·Granted Sep 17, 2019·0 cites·15 claims
- 2750US7033672B2Static dissipation treatments for optical package windowsANALOG DEVICES INC·Filed 2002·Granted Apr 25, 2006·7 cites·13 claims
- 2847US10315914B2Reconstructed wafer based devices with embedded environmental sensors and process for making sameCHARLES STARK DRAPER LABORATORY INC·Filed 2017·Granted Jun 11, 2019·0 cites·15 claims
- 2944US10265516B2Closely spaced array of penetrating electrodesCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Apr 23, 2019·0 cites·15 claims
- 3044US7338705B2Static dissipation treatments for optical package windowsANALOG DEVICES INC·Filed 2006·Granted Mar 4, 2008·1 cites·20 claims
- 3141US2013316497A1Three dimensional microelectronic components and fabrication methods for sameKARPMAN MAURICE SAMUEL·Filed 2012·Application pending·0 cites
- 3239US10453787B2Method and apparatus for forming multi-layered vias in sequentially fabricated circuitsCHARLES STARK DRAPER LABORATORY INC·Filed 2016·Granted Oct 22, 2019·0 cites·11 claims
- 3338US9293440B2Method for interconnecting die and substrate in an electronic packageDRAPER LAB CHARLES S·Filed 2013·Granted Mar 22, 2016·0 cites·8 claims
- 3438US8785249B2Three dimensional microelectronic components and fabrication methods for sameKARPMAN MAURICE·Filed 2012·Granted Jul 22, 2014·0 cites·24 claims
- 3536US6893976B2Shadow mask and method of producing the sameANALOG DEVICES INC·Filed 2002·Granted May 17, 2005·0 cites·20 claims
- 3635US2005056870A1Stress sensitive microchip with premolded-type packageFiled 2004·Application pending·0 cites
- 3735US2004063237A1Fabricating complex micro-electromechanical systems using a dummy handling substrateFiled 2002·Application pending·0 cites
- 3833US5361490AMethod for making tape automated bonding (TAB) semiconductor deviceMOTOROLA INC·Filed 1993·Granted Nov 8, 1994·4 cites·18 claims
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