Inventor

MA QING

US204 patents

⚠️ This page may combine multiple inventors who share the name “MA QING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MA QING

INTEL CORP

Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby

Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby

Vacuum-cavity MEMS resonator

Direct build-up layer on an encapsulated die package having a moisture barrier structure

Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby

Direct build-up layer on an encapsulated die package

Direct build-up layer on an encapsulated die package having a moisture barrier structure

Vacuum-cavity MEMS resonator

Packaging microelectromechanical structures

MEMS device integrated chip package, and method of making same

Integrated core microelectronic package

Tunable inductor using microelectromechanical switches

Silicon interposer and multi-chip-module (MCM) with through substrate vias

Microelectromechanical (MEMS) switch using stepped actuation electrodes

Silicon interposer and multi-chip-module (MCM) with through substrate vias

Structures and processes for fabricating moisture resistant chip-on-flex packages

Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures

Module integrating MEMS and passive components

Microelectromechanical (MEMS) switching apparatus

Structure and process for reducing die corner and edge stresses in microelectronic packages

Structure for reducing die corner and edge stresses in microelectronic packages

Multiplex data collection and analysis in bioanalyte detection

Slot antenna having a MEMS varactor for resonance frequency tuning

Methods for forming a frequency bulk acoustic resonator with uniform frequency utilizing multiple trimming layers and structures formed thereby

Packaging microelectromechanical structures

Electrode configuration in a MEMS switch

Integrated core microelectronic package

Method of fabricating an integrated circuit that seals a MEMS device within a cavity

Die-in-heat spreader microelectronic package

Packaging microelectromechanical structures

Process for forming microelectronic packages and intermediate structures formed therewith

High-speed MEMS switch with high-resonance-frequency beam

Integrated circuit guard ring structures

Micro-electromechanical structure resonator, method of making, and method of using

Variable tunable range MEMS capacitor

Microelectromechanical (MEMS) switching apparatus

Method for making a semiconductor device having a low-k dielectric layer

Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications thereof

Isolation structure configurations for modifying stresses in semiconductor devices

Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units

Biosensor utilizing a resonator having a functionalized surface

Biosensor utilizing a resonator having a functionalized surface

Miniature chemical analysis system

MEMS device integrated chip package, and method of making same

Micro-electromechanical structure resonator frequency adjustment using radiant energy trimming and laser/focused ion beam assisted deposition

Variable tunable range MEMS capacitor

System that includes an electrode configuration in a MEMS switch

Fabrication of on-package and on-chip structure using build-up layer process

Method of forming a beam for a MEMS switch

MA QING

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips