Inventor
CHOE JEONG-DONG
KR43 patents
⚠️ This page may combine multiple inventors who share the name “CHOE JEONG-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
34 patentsUS7670912B2Mar 2, 2010
Methods of fabricating multichannel metal oxide semiconductor (MOS) transistors
SAMSUNG ELECTRONICS CO LTD172 citations99
US7332386B2Feb 19, 2008
Methods of fabricating fin field transistors
SAMSUNG ELECTRONICS CO LTD56 citations98
US7002207B2Feb 21, 2006
Field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD74 citations98
US7615429B2Nov 10, 2009
Methods of fabricating field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD39 citations96
US7148527B2Dec 12, 2006
Semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD54 citations96
US7247896B2Jul 24, 2007
Semiconductor devices having a field effect transistor and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD25 citations93
US7381601B2Jun 3, 2008
Methods of fabricating field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD24 citations92
US7285466B2Oct 23, 2007
Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channels
SAMSUNG ELECTRONICS CO LTD28 citations92
US7122431B2Oct 17, 2006
Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD20 citations92
US7071517B2Jul 4, 2006
Self-aligned semiconductor contact structures and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD28 citations92
US7026688B2Apr 11, 2006
Field effect transistors having multiple stacked channels
SAMSUNG ELECTRONICS CO LTD22 citations92
US6940129B2Sep 6, 2005
Double gate MOS transistors
SAMSUNG ELECTRONICS CO LTD20 citations92
US7510932B2Mar 31, 2009
Semiconductor devices having a field effect transistor and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US7473963B2Jan 6, 2009
Metal oxide semiconductor (MOS) transistors having three dimensional channels
SAMSUNG ELECTRONICS CO LTD8 citations84
US7397131B2Jul 8, 2008
Self-aligned semiconductor contact structures
SAMSUNG ELECTRONICS CO LTD12 citations84
US7265031B2Sep 4, 2007
Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces
SAMSUNG ELECTRONICS CO LTD10 citations84
US7015549B2Mar 21, 2006
Integrated circuit structures including epitaxial silicon layers that extend from an active region through an insulation layer to a substrate
SAMSUNG ELECTRONICS CO LTD13 citations84
US7321144B2Jan 22, 2008
Semiconductor device employing buried insulating layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US7154154B2Dec 26, 2006
MOS transistors having inverted T-shaped gate electrodes
SAMSUNG ELECTRONICS CO LTD8 citations74
US7132349B2Nov 7, 2006
Methods of forming integrated circuits structures including epitaxial silicon layers in active regions
SAMSUNG ELECTRONICS CO LTD9 citations74
US7883969B2Feb 8, 2011
Metal oxide semiconductor field effect transistors (MOSFETs) including recessed channel regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7575964B2Aug 18, 2009
Semiconductor device employing buried insulating layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7541656B2Jun 2, 2009
Semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009
Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD4 citations63
US7361956B2Apr 22, 2008
Semiconductor device having partially insulated field effect transistor (PiFET) and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7265011B2Sep 4, 2007
Method of manufacturing a transistor
SAMSUNG ELECTRONICS CO LTD6 citations63
US6951785B2Oct 4, 2005
Methods of forming field effect transistors including raised source/drain regions
SAMSUNG ELECTRONICS CO LTD6 citations63
US8049269B2Nov 1, 2011
Non-volatile memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US7902024B2Mar 8, 2011
Nonvolatile semiconductor device including a floating gate, method of manufacturing the same and associated systems
SAMSUNG ELECTRONICS CO LTD2 citations62
US8039905B2Oct 18, 2011
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations52
US7871914B2Jan 18, 2011
Methods of fabricating semiconductor devices with enlarged recessed gate electrodes
SAMSUNG ELECTRONICS CO LTD0 citations52
US7534707B2May 19, 2009
MOS Transistors having inverted T-shaped gate electrodes and fabrication methods thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US7214987B2May 8, 2007
Semiconductor device having two different operation modes employing an asymmetrical buried insulating layer and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US8035152B2Oct 11, 2011
Semiconductor device having shared bit line structure
SAMSUNG ELECTRONICS CO LTD0 citations51