P

Inventor

CHOE JEONG-DONG

KR43 patents
⚠️ This page may combine multiple inventors who share the name “CHOE JEONG-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

34 patents
US7670912B2Mar 2, 2010

Methods of fabricating multichannel metal oxide semiconductor (MOS) transistors

SAMSUNG ELECTRONICS CO LTD172 citations99
US7332386B2Feb 19, 2008

Methods of fabricating fin field transistors

SAMSUNG ELECTRONICS CO LTD56 citations98
US7002207B2Feb 21, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD74 citations98
US7615429B2Nov 10, 2009

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD39 citations96
US7148527B2Dec 12, 2006

Semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD54 citations96
US7247896B2Jul 24, 2007

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD25 citations93
US7381601B2Jun 3, 2008

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD24 citations92
US7285466B2Oct 23, 2007

Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD28 citations92
US7122431B2Oct 17, 2006

Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD20 citations92
US7071517B2Jul 4, 2006

Self-aligned semiconductor contact structures and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD28 citations92
US7026688B2Apr 11, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD22 citations92
US6940129B2Sep 6, 2005

Double gate MOS transistors

SAMSUNG ELECTRONICS CO LTD20 citations92
US7510932B2Mar 31, 2009

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US7473963B2Jan 6, 2009

Metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD8 citations84
US7397131B2Jul 8, 2008

Self-aligned semiconductor contact structures

SAMSUNG ELECTRONICS CO LTD12 citations84
US7265031B2Sep 4, 2007

Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces

SAMSUNG ELECTRONICS CO LTD10 citations84
US7015549B2Mar 21, 2006

Integrated circuit structures including epitaxial silicon layers that extend from an active region through an insulation layer to a substrate

SAMSUNG ELECTRONICS CO LTD13 citations84
US7321144B2Jan 22, 2008

Semiconductor device employing buried insulating layer and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US7154154B2Dec 26, 2006

MOS transistors having inverted T-shaped gate electrodes

SAMSUNG ELECTRONICS CO LTD8 citations74
US7132349B2Nov 7, 2006

Methods of forming integrated circuits structures including epitaxial silicon layers in active regions

SAMSUNG ELECTRONICS CO LTD9 citations74
US7883969B2Feb 8, 2011

Metal oxide semiconductor field effect transistors (MOSFETs) including recessed channel regions and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US7575964B2Aug 18, 2009

Semiconductor device employing buried insulating layer and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7541656B2Jun 2, 2009

Semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009

Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD4 citations63
US7361956B2Apr 22, 2008

Semiconductor device having partially insulated field effect transistor (PiFET) and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US7265011B2Sep 4, 2007

Method of manufacturing a transistor

SAMSUNG ELECTRONICS CO LTD6 citations63
US6951785B2Oct 4, 2005

Methods of forming field effect transistors including raised source/drain regions

SAMSUNG ELECTRONICS CO LTD6 citations63
US8049269B2Nov 1, 2011

Non-volatile memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations62
US7902024B2Mar 8, 2011

Nonvolatile semiconductor device including a floating gate, method of manufacturing the same and associated systems

SAMSUNG ELECTRONICS CO LTD2 citations62
US8039905B2Oct 18, 2011

Semiconductor device

SAMSUNG ELECTRONICS CO LTD1 citations52
US7871914B2Jan 18, 2011

Methods of fabricating semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD0 citations52
US7534707B2May 19, 2009

MOS Transistors having inverted T-shaped gate electrodes and fabrication methods thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US7214987B2May 8, 2007

Semiconductor device having two different operation modes employing an asymmetrical buried insulating layer and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations52
US8035152B2Oct 11, 2011

Semiconductor device having shared bit line structure

SAMSUNG ELECTRONICS CO LTD0 citations51

LEE SE-HOON

2 patents

YOON YOUNG-BAE

2 patents

OH CHANG-WOO

1 patent

HYUNDAI ELECTRONICS IND

1 patent

TOKASHIKI KEN

1 patent

JANG DONG-HOON

1 patent

LEE HAK-SUN

1 patent