Inventor · disambiguated record
Koo Hong Lee
Also filed as: LEE KOO H · LEE KOO HONG
19 granted patents·1 pending application·207 citations·filing 2002–2013
93Inventor score
Top patents by PatentIndex Score
20 records- 0194US6661083B2Plastic semiconductor packageCHIPPAC INC·Filed 2002·Granted Dec 9, 2003·102 cites·10 claims
- 0288US7683467B2Integrated circuit package system employing structural supportSTATS CHIPPAC LTD·Filed 2006·Granted Mar 23, 2010·17 cites·20 claims
- 0388US7622333B2Integrated circuit package system for package stacking and manufacturing method thereofSTATS CHIPPAC LTD·Filed 2006·Granted Nov 24, 2009·14 cites·5 claims
- 0486US8710675B2Integrated circuit package system with bonding landsKIM YOUNG CHEOL·Filed 2007·Granted Apr 29, 2014·17 cites·12 claims
- 0586US7645638B2Stackable multi-chip package system with support structureSTATS CHIPPAC LTD·Filed 2006·Granted Jan 12, 2010·13 cites·10 claims
- 0685US7736950B2Flip chip interconnectionSTATS CHIPPAC LTD·Filed 2006·Granted Jun 15, 2010·15 cites·33 claims
- 0777US8471374B2Integrated circuit package system with L-shaped leadfingersKIM YOUNG CHEOL·Filed 2007·Granted Jun 25, 2013·6 cites·20 claims
- 0875US7915724B2Integrated circuit packaging system with base structure deviceSTATS CHIPPAC LTD·Filed 2007·Granted Mar 29, 2011·6 cites·20 claims
- 0973US8125076B2Semiconductor package system with substrate heat sinkKIM GWANG·Filed 2005·Granted Feb 28, 2012·9 cites·20 claims
- 1072US7521297B2Multichip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 21, 2009·5 cites·20 claims
- 1157US8026582B2Integrated circuit package system with internal stacking module adhesiveSTATS CHIPPAC LTD·Filed 2008·Granted Sep 27, 2011·1 cites·20 claims
- 1257US8012867B2Wafer level chip scale package systemSTATS CHIPPAC LTD·Filed 2006·Granted Sep 6, 2011·1 cites·20 claims
- 1354US7915738B2Stackable multi-chip package system with support structureSTATS CHIPPAC LTD·Filed 2009·Granted Mar 29, 2011·0 cites·9 claims
- 1452US8067272B2Integrated circuit package system for package stacking and manufacturing method thereofKIM YOUNG CHEOL·Filed 2009·Granted Nov 29, 2011·0 cites·15 claims
- 1547US8410594B2Inter-stacking module systemHWANG KWANG SOON·Filed 2006·Granted Apr 2, 2013·1 cites·8 claims
- 1647US7947535B2Thin package system with external terminalsSTATS CHIPPAC LTD·Filed 2005·Granted May 24, 2011·0 cites·10 claims
- 1742US2015001741A1Semiconductor Device and Method of Forming an Interposer Including a Beveled EdgeSTATS CHIPPAC LTD·Filed 2013·Application pending·0 cites
- 1841US9768102B2Integrated circuit packaging system with support structure and method of manufacture thereofJEON DONG JU·Filed 2012·Granted Sep 19, 2017·0 cites·19 claims
- 1941US8481371B2Thin package system with external terminals and method of manufacture thereofKIM YOUNGCHEOL·Filed 2011·Granted Jul 9, 2013·0 cites·20 claims
- 2037US8432026B2Stackable multi-chip package systemLEE KOO HONG·Filed 2006·Granted Apr 30, 2013·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →