Inventor

HSIEH CHI-CHUN

TW10 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH CHI-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

3 patents

US7767471B2Aug 3, 2010

Auto routing for optimal uniformity control

TAIWAN SEMICONDUCTOR MFG3 citations62

US7851234B2Dec 14, 2010

System and method for enhanced control of copper trench sheet resistance uniformity

TAIWAN SEMICONDUCTOR MFG4 citations61

US9159673B2Oct 13, 2015

Forming interconnect structures using pre-ink-printed sheets

TAIWAN SEMICONDUCTOR MFG1 citations51

TAIWAN SEMICONDUCTOR MFG CO LTD

2 patents

US9691840B2Jun 27, 2017

Cylindrical embedded capacitors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

USRE47709ENov 5, 2019

Forming grounded through-silicon vias in a semiconductor substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

HSIEH CHI-CHUN

1 patent

US8872345B2Oct 28, 2014

Forming grounded through-silicon vias in a semiconductor substrate

HSIEH CHI-CHUN14 citations80

SU AN-JHIH

1 patent

US8693163B2Apr 8, 2014

Cylindrical embedded capacitors

SU AN-JHIH6 citations79

KO FRANCIS

1 patent

US8716867B2May 6, 2014

Forming interconnect structures using pre-ink-printed sheets

KO FRANCIS3 citations61

WANG TZU-YU

1 patent

US8294264B2Oct 23, 2012

Radiate under-bump metallization structure for semiconductor devices

WANG TZU-YU5 citations61

MUTUAL PAK TECH CO LTD

1 patent

US11225113B2Jan 18, 2022

Unique ID electronic tag for tire

MUTUAL PAK TECH CO LTD0 citations40