Inventor · disambiguated record
Ming-Chun Chou
Also filed as: CHOU MING-CHUN
9 granted patents·3 pending applications·34 citations·filing 1999–2012
84Inventor score
Top patents by PatentIndex Score
12 records- 0161US8493700B2ESD protection for high-voltage-tolerance open-drain output padHSIHE WU-TSUNG·Filed 2011·Granted Jul 23, 2013·2 cites·8 claims
- 0256US6420703B1Method for forming a critical dimension SEM calibration standard of improved definition and standard formedTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 16, 2002·14 cites·20 claims
- 0351US8164870B2ESD protection for high-voltage-tolerance open-drain output padHSIHE WU-TSUNG·Filed 2009·Granted Apr 24, 2012·1 cites·14 claims
- 0450US6778285B1Automatic in situ pellicle height measurement systemWAFERTECH INC·Filed 2000·Granted Aug 17, 2004·8 cites·20 claims
- 0545US8476563B2Induction heating cooker and control circuit thereforGONG PEI-MIN·Filed 2008·Granted Jul 2, 2013·0 cites·44 claims
- 0644US9313830B2Induction heating cooker and control circuit thereforGONG PEI-MIN·Filed 2012·Granted Apr 12, 2016·0 cites·6 claims
- 0738US2009243714A1Power noise immunity circuitCHOU MING-CHUN·Filed 2009·Application pending·0 cites
- 0835US6248601B1Fix the glassivation layer's micro crack point precisely by using electroplating methodTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 19, 2001·6 cites·4 claims
- 0935US2005229950A1Brush positioning device for a wafer cleaning stationCHOU MING-CHUN·Filed 2004·Application pending·0 cites
- 1034US6433575B2Check abnormal contact and via holes by electroplating methodTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 13, 2002·0 cites·4 claims
- 1134US2001016420A1Fix the glassivation layer's micro crack point precisely by using electroplating methodTAIWAN SEMICONDUCTOR MFG·Filed 2001·Application pending·0 cites
- 1229US6261852B1Check abnormal contact and via holes by electroplating methodTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 17, 2001·3 cites·6 claims
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