Inventor
HAN SEONG-CHAN
KR21 patents
⚠️ This page may combine multiple inventors who share the name “HAN SEONG-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS6449156B1Sep 10, 2002
Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD52 citations90
US6062799AMay 16, 2000
Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules
SAMSUNG ELECTRONICS CO LTD55 citations90
US5927504AJul 27, 1999
Apparatus for carrying plural printed circuit boards for semiconductor module
SAMSUNG ELECTRONICS CO LTD52 citations90
US8385080B2Feb 26, 2013
Semiconductor module, socket for the same, and semiconductor module/socket assembly
SAMSUNG ELECTRONICS CO LTD16 citations84
US7960655B2Jun 14, 2011
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module
SAMSUNG ELECTRONICS CO LTD9 citations84
US7791178B2Sep 7, 2010
Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US7663219B2Feb 16, 2010
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7900349B2Mar 8, 2011
Method of fabricating an electronic device
SAMSUNG ELECTRONICS CO LTD3 citations61
US7902664B2Mar 8, 2011
Semiconductor package having passive component and semiconductor memory module including the same
SAMSUNG ELECTRONICS CO LTD3 citations60
US7576437B2Aug 18, 2009
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations60
US10734258B2Aug 4, 2020
Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US7906423B2Mar 15, 2011
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US8053889B2Nov 8, 2011
Semiconductor module
SAMSUNG ELECTRONICS CO LTD0 citations49
US9922846B2Mar 20, 2018
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations43