Semiconductor module, socket for the same, and semiconductor module/socket assembly

Abstract

A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

1. A socket into which a semiconductor module having a printed circuit board and a plurality of semiconductor devices mounted on the printed circuit board is inserted, the socket comprising:
 a base member configured to couple to the printed circuit board of the semiconductor module; and 
 a plurality of latch members configured to secure the printed circuit board to the base member, the base member including,
 an inner body having a slot into which a first end of the printed circuit board is inserted; 
 an outer body coupled to the inner body, the outer body being formed of metal, and the outer body including,
 a plurality coupling portions, a first coupling portion being formed at a first end of the outer body, and a second coupling portion being formed at a second end of the outer body; and 
 a plurality of lower grooves formed in the plurality coupling portions and configured to allow lower portions of the printed circuit board to be inserted thereinto; and 
 
 
 the plurality of latch members including,
 a first latch body and a second latch body including metal, the first latch body pivotably coupled to the first coupling portion and the second latch body pivotably coupled to the second coupling portion; and 
 a first upper groove formed in the first latch body and a second upper groove formed in the second latch body configured to allow each of upper portions of the printed circuit board to be inserted thereinto. 
 
 
     
     
       2. The socket of  claim 1 , wherein the outer body, the first latch body and the second latch body include copper (Cu) or aluminum (Al). 
     
     
       3. The socket of  claim 1 , wherein the outer body includes one or more air guide grooves. 
     
     
       4. The socket of  claim 3 , wherein the one or more air guide grooves are formed in a first surface of the outer body and extend in a first direction of the outer body. 
     
     
       5. The socket of  claim 1 , wherein, if the semiconductor module is inserted into the socket, the lower grooves and the first and the second upper grooves are aligned with each other. 
     
     
       6. The socket of  claim 1 , wherein the inner body includes an insulating material, and a plurality of socket pins arranged at both sides of the slot are coupled to the inner body. 
     
     
       7. The socket of  claim 1 , wherein each of the first latch body and the second latch body further comprise:
 a hook inserted into each of hook insertion grooves of the printed circuit board. 
 
     
     
       8. The socket of  claim 7 , wherein the hooks include an insulating material, and are coupled as a separate member to a respective one of the first latch body and the second latch body. 
     
     
       9. A semiconductor module/socket assembly comprising:
 a semiconductor module including;
 a printed circuit board including a plurality of insulating layers and a plurality of metal layers that are alternately stacked; and 
 a plurality of semiconductor devices mounted on the printed circuit board; and 
 
 a socket for the semiconductor module including,
 a base member including an inner body having a slot into which a lower end of the printed circuit board is inserted, an outer body formed of metal coupled to the inner body, and the outer body including, 
 a first coupling portion formed at a first end of the outer body and a second coupling portion formed at a second end of the outer body, and lower grooves formed in the first and the second coupling portions, and the lower groves configured to allow lower portions of a first and a second ends of the printed circuit board to be inserted thereinto, and the first end and the second end are at opposite ends of the printed circuit board, and 
 a first latch member formed of metal and including a first latch body, the first latch body being pivotably coupled to the first coupling portion, and a second latch member formed of metal and including a second latch body, the second latch body being pivotably coupled to the second coupling portion, and the first and the second latch members configured to allow upper portions of the first and the second ends of the printed circuit board to be inserted thereinto, 
 
 wherein exposed portions of the plurality of metal layers are exposed to the outside of the semiconductor module at the first and the second ends of the printed circuit board, and the exposed portions of the plurality of metal layers contact the outer body, the first latch body and the second latch body the upper grooves, and the first coupling portion and the second coupling portion in the lower grooves. 
 
     
     
       10. The semiconductor module/socket assembly of  claim 9 , wherein
 the plurality of insulating layers include outer insulating layers disposed on a first and a second surfaces of the printed circuit board and inner insulating layers; 
 the plurality of metal layers include ground metal layers disposed on inner surfaces of the outer insulating layers and signal lines, the signal lines and the inner insulating layers being alternately disposed between the ground metal layers; and 
 wherein portions of the outer insulating layers are removed from both ends of the printed circuit board so that the ground metal layers are exposed to the outside of the semiconductor module. 
 
     
     
       11. The semiconductor module/socket assembly of  claim 9 , wherein each of the plurality of metal layers, the outer body of the base member, the first latch body and the second latch bodies include copper (Cu) or aluminum (Al). 
     
     
       12. The semiconductor module/socket assembly of  claim 9 , wherein a plurality of circuit connecting tabs are arranged at lower portions of the printed circuit board, the inner body includes an insulating material, and a plurality of socket pins coupled to the inner body and the plurality of the socket pins arranged at both sides of the slot and electrically contact the plurality of circuit connecting tabs. 
     
     
       13. The semiconductor module/socket assembly of  claim 9 , wherein hook insertion grooves are formed in the first and the second ends of the printed circuit board, and the first latch member and the second latch member include a first and a second hooks that are configured to be inserted into a respective one of the hook insertion grooves formed in the first and the second ends of the printed circuit board. 
     
     
       14. The semiconductor module/socket assembly of  claim 13 , wherein the first and the second hooks include an insulating material, and are coupled as a separate member to a respective one of the first latch body and the second latch bodies. 
     
     
       15. The semiconductor module/socket assembly of  claim 9 , wherein the bottom surface of the outer body includes one or more air guide grooves, and the one or more air grooves extend in a first direction of the outer body. 
     
     
       16. The semiconductor module/socket assembly of  claim 9 , wherein, if the semiconductor module is inserted into the socket, the lower grooves and the upper grooves are aligned.