Inventor · disambiguated record
Dong-Chun Lee
Also filed as: LEE DONG CHUN · LEE DONG HAN
44 granted patents·26 pending applications·464 citations·filing 1998–2024
98Inventor score
Files withSAMSUNG ELECTRONICS CO LTD30SAMSUNG DISPLAY CO LTD6LG ENERGY SOLUTION LTD5MIRAE CORP5ELECTRONICS & TELECOMMUNICATIONS RES INST4
Top patents by PatentIndex Score
70 records- 0194US7215026B2Semiconductor module and method of forming a semiconductor moduleSAMSUNG ELECTONICS CO LTD·Filed 2005·Granted May 8, 2007·42 cites·36 claims
- 0293US8385080B2Semiconductor module, socket for the same, and semiconductor module/socket assemblySAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 26, 2013·16 cites·16 claims
- 0388US7518873B2Heat spreader, semiconductor package module and memory module having the heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·20 cites·37 claims
- 0488US6449156B1Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 10, 2002·52 cites·13 claims
- 0586US11476681B2Battery management apparatus and methodLG CHEMICAL LTD·Filed 2019·Granted Oct 18, 2022·5 cites·17 claims
- 0683US6687011B1Transmission-type extrinsic fabry-perot interferometric optical fiber sensorKOREA ADVANCED INST SCIENCE AN·Filed 1999·Granted Feb 3, 2004·68 cites·6 claims
- 0782US2025116720A1Battery diagnosing apparatus and methodLG ENERGY SOLUTION LTD·Filed 2024·Application pending·0 cites
- 0881US7960655B2Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 14, 2011·9 cites·9 claims
- 0981US6062799AApparatus and method for automatically loading or unloading printed circuit boards for semiconductor modulesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 16, 2000·55 cites·16 claims
- 1080US5927504AApparatus for carrying plural printed circuit boards for semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 27, 1999·52 cites·10 claims
- 1177US8189342B2Printed circuit board for memory module, method of manufacturing the same and memory module/socket assemblyBANG HYO-JAE·Filed 2006·Granted May 29, 2012·8 cites·10 claims
- 1277US7521788B2Semiconductor module with conductive element between chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·8 cites·30 claims
- 1375US8827817B2Apparatus and method for collecting game dataKIM JU-YOUNG·Filed 2011·Granted Sep 9, 2014·4 cites·14 claims
- 1472US7728966B2Optical inspection tool having lens unit with multiple beam paths for detecting surface defects of a substrate and methods of using sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 1, 2010·4 cites·31 claims
- 1571US12210065B2Battery diagnosing apparatus and methodLG ENERGY SOLUTION LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 1670US8556725B2Scenario-based load testing apparatus and methodCHO CHANG-SIK·Filed 2011·Granted Oct 15, 2013·3 cites·10 claims
- 1770US8218330B2Reworkable passive element embedded printed circuit boardBANG HYO-JAE·Filed 2007·Granted Jul 10, 2012·4 cites·15 claims
- 1866US6425178B1Carrier for a module integrated circuit handlerMIRAE CORP·Filed 1999·Granted Jul 30, 2002·21 cites·17 claims
- 1966US2024021854A1Hydrogen supply system for fuel cell and control method thereofHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 2065US12429977B2Sensor device and display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 2165US12373064B2Sensor device and display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 2265US10032288B2Method and system for generating integral image markerELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Jul 24, 2018·1 cites·20 claims
- 2365US7576437B2Printed circuit board of semiconductor package and method for mounting semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·3 cites·16 claims
- 2464US12271552B2Touch sensor and method to sense touch of user having touch electrodesSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·17 claims
- 2564US7663219B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 2663US7902664B2Semiconductor package having passive component and semiconductor memory module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 2763US6800863B2Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 5, 2004·6 cites·40 claims
- 2862US6629812B1Method and apparatus for circulating pallets in an elevator unit of the module IC handlerMIRAE CORP·Filed 1999·Granted Oct 7, 2003·29 cites·27 claims
- 2960US7906423B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 15, 2011·1 cites·7 claims
- 3059US12373056B2Multi-user touch detection circuit and display device including the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 3159US2024274261A1System, device, and method for controlling rehabilitation of patientELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 3259US2010015362A1Method of electroless platingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3357US11775104B2Display device and driving method thereofSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·18 claims
- 3457US7675176B2Semiconductor package and module printed circuit board for mounting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 9, 2010·1 cites·19 claims
- 3557US2024168627A1Dispay device and driving method thereofSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 3655US12032028B2Apparatus and method for diagnosing state of batteryLG ENERGY SOLUTION LTD·Filed 2020·Granted Jul 9, 2024·0 cites·18 claims
- 3752US12135356B2Apparatus and method for diagnosing state of battery packLG ENERGY SOLUTION LTD·Filed 2020·Granted Nov 5, 2024·0 cites·13 claims
- 3852US7280233B2Method and apparatus for inspecting an edge exposure area of a waferSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 9, 2007·4 cites·21 claims
- 3952US6498472B1Method for handling a module IC and a carrier of a module IC handlerMIRAE CORP·Filed 1999·Granted Dec 24, 2002·17 cites·17 claims
- 4051US11835586B2Battery management apparatus and methodLG ENERGY SOLUTION LTD·Filed 2020·Granted Dec 5, 2023·0 cites·9 claims
- 4151US7027638B2Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 11, 2006·4 cites·18 claims
- 4251US6815236B2Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 9, 2004·3 cites·14 claims
- 4351US2007161224A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2007·Application pending·0 cites
- 4450US2009257209A1Semiconductor package and associated methodsHAN SEONG-CHAN·Filed 2009·Application pending·0 cites
- 4550US2007069378A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2006·Application pending·0 cites
- 4649US2014213353A1Apparatus and method for providing streaming-based game imagesKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4749US2014243056A1Multiple viewpoint rendering method for multiplayer online game and multiple viewpoint rendering server using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4849US2007189451A1Apparatus for inspecting a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4947US2013040740A1Method and apparatus for testing stability of game serverKOREA ELECTRONICS TELECOMM·Filed 2012·Application pending·0 cites
- 5046US2007181993A1Printed circuit board including reinforced copper plated film and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →