P

Inventor

LEE DONG-CHUN

KR44 patents
⚠️ This page may combine multiple inventors who share the name “LEE DONG-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

20 patents
US7518873B2Apr 14, 2009

Heat spreader, semiconductor package module and memory module having the heat spreader

SAMSUNG ELECTRONICS CO LTD20 citations90
US6449156B1Sep 10, 2002

Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD52 citations90
US6062799AMay 16, 2000

Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules

SAMSUNG ELECTRONICS CO LTD55 citations90
US5927504AJul 27, 1999

Apparatus for carrying plural printed circuit boards for semiconductor module

SAMSUNG ELECTRONICS CO LTD52 citations90
US8385080B2Feb 26, 2013

Semiconductor module, socket for the same, and semiconductor module/socket assembly

SAMSUNG ELECTRONICS CO LTD16 citations84
US7960655B2Jun 14, 2011

Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module

SAMSUNG ELECTRONICS CO LTD9 citations84
US7521788B2Apr 21, 2009

Semiconductor module with conductive element between chip packages

SAMSUNG ELECTRONICS CO LTD8 citations83
US7663219B2Feb 16, 2010

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US6815236B2Nov 9, 2004

Method of measuring a concentration of a material and method of measuring a concentration of a dopant of a semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations62
US7728966B2Jun 1, 2010

Optical inspection tool having lens unit with multiple beam paths for detecting surface defects of a substrate and methods of using same

SAMSUNG ELECTRONICS CO LTD4 citations61
US7280233B2Oct 9, 2007

Method and apparatus for inspecting an edge exposure area of a wafer

SAMSUNG ELECTRONICS CO LTD4 citations61
US7902664B2Mar 8, 2011

Semiconductor package having passive component and semiconductor memory module including the same

SAMSUNG ELECTRONICS CO LTD3 citations60
US7576437B2Aug 18, 2009

Printed circuit board of semiconductor package and method for mounting semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD3 citations60
US7027638B2Apr 11, 2006

Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the same

SAMSUNG ELECTRONICS CO LTD4 citations60
US6800863B2Oct 5, 2004

Method for monitoring an ion implanter and ion implanter having a shadow jig for performing the same

SAMSUNG ELECTRONICS CO LTD6 citations59
US7338568B2Mar 4, 2008

Method and arrangement for attaching labels to semiconductor modules

SAMSUNG ELECTRONICS CO LTD2 citations58
US7906423B2Mar 15, 2011

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations52
US7675176B2Mar 9, 2010

Semiconductor package and module printed circuit board for mounting the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US7061768B2Jun 13, 2006

Open socket

SAMSUNG ELECTRONICS CO LTD1 citations51
US7498248B2Mar 3, 2009

Methods of compensating for an alignment error during fabrication of structures on semiconductor substrates

SAMSUNG ELECTRONICS CO LTD0 citations38

MIRAE CORP

5 patents

SAMSUNG DISPLAY CO LTD

5 patents

LG ENERGY SOLUTION LTD

4 patents

BANG HYO-JAE

2 patents

ELECTRONICS & TELECOMMUNICATIONS RES INST

2 patents

KOREA ADVANCED INST SCIENCE AN

1 patent

SAMSUNG ELECTONICS CO LTD

1 patent

LG CHEMICAL LTD

1 patent

KIM JU-YOUNG

1 patent

CHO CHANG-SIK

1 patent

KIM YOUNG-HOON

1 patent