Inventor
LAI WEI-JEN
TW48 patents
⚠️ This page may combine multiple inventors who share the name “LAI WEI-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
17 patentsUS9419134B2Aug 16, 2016
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US12080759B2Sep 3, 2024
Transistor source/drain regions and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11855207B2Dec 26, 2023
FinFET structure and method with reduced fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11489078B2Nov 1, 2022
Lightly-doped channel extensions
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11411107B2Aug 9, 2022
FinFET structure and method with reduced fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10861969B2Dec 8, 2020
Method of forming FinFET structure with reduced Fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10141310B2Nov 27, 2018
Short channel effect suppression
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9721829B2Aug 1, 2017
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12302611B2May 13, 2025
FinFET structure with a composite stress layer and reduced fin buckling
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11626328B2Apr 11, 2023
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018061B2May 25, 2021
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12015090B2Jun 18, 2024
Lightly-doped channel extensions
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12520526B2Jan 6, 2026
Semiconductor devices with modified source/drain feature and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12080800B2Sep 3, 2024
Semiconductor devices with modified source/drain feature and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11791402B2Oct 17, 2023
Semiconductor device having strained channels
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10290550B2May 14, 2019
Strain enhancement for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9887100B2Feb 6, 2018
Methods of forming semiconductor devices and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
IBIS INNOTECH INC
5 patentsUS10256180B2Apr 9, 2019
Package structure and manufacturing method of package structure
IBIS INNOTECH INC37 citations93
US9859193B2Jan 2, 2018
Package structure
IBIS INNOTECH INC2 citations72
US10134668B2Nov 20, 2018
Package structure
IBIS INNOTECH INC1 citations51
US10090256B2Oct 2, 2018
Semiconductor structure
IBIS INNOTECH INC1 citations51
US9451694B2Sep 20, 2016
Package substrate structure
IBIS INNOTECH INC1 citations51
TAIWAN TEXTILE RES INST
5 patentsUS12221723B2Feb 11, 2025
Liquid color masterbatch composition and fabricating method for colored fiber
TAIWAN TEXTILE RES INST0 citations59
US12012512B2Jun 18, 2024
Abrasion resistance fiber
TAIWAN TEXTILE RES INST0 citations56
US12071522B2Aug 27, 2024
Liquid color masterbatch composition and fabricating method for colored fiber
TAIWAN TEXTILE RES INST0 citations53
US10851206B2Dec 1, 2020
Modified nylon 66 fiber
TAIWAN TEXTILE RES INST0 citations47
US11746285B2Sep 5, 2023
Intrinsic fluorescent green fiber and manufacturing method thereof
TAIWAN TEXTILE RES INST0 citations45
NOVATEK MICROELECTRONICS CORP
5 patentsUS11265986B2Mar 1, 2022
LED controller, LED control device and LED control method
NOVATEK MICROELECTRONICS CORP0 citations55
US10966296B1Mar 30, 2021
LED controller, LED control device and LED control method
NOVATEK MICROELECTRONICS CORP0 citations55
US11019700B2May 25, 2021
LED driving system and LED driving device
NOVATEK MICROELECTRONICS CORP0 citations52
US12531483B2Jan 20, 2026
Switchable power supply circuit for realizing various switching converters
NOVATEK MICROELECTRONICS CORP0 citations50
US12131716B1Oct 29, 2024
Gate line driver for display panel
NOVATEK MICROELECTRONICS CORP0 citations50
SITRON PRECISION CO LTD
3 patentsUS5994767ANov 30, 1999
Leadframe for integrated circuit package and method of manufacturing the same
SITRON PRECISION CO LTD41 citations92
US5889317AMar 30, 1999
Leadframe for integrated circuit package
SITRON PRECISION CO LTD35 citations92
US5882955AMar 16, 1999
Leadframe for integrated circuit package and method of manufacturing the same
SITRON PRECISION CO LTD50 citations92
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9257344B2Feb 9, 2016
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG5 citations84
US9087725B2Jul 21, 2015
FinFETs with different fin height and EPI height setting
TAIWAN SEMICONDUCTOR MFG11 citations84
US9397097B2Jul 19, 2016
Gate structure for semiconductor device
TAIWAN SEMICONDUCTOR MFG2 citations58
LAI WEI-JEN
2 patentsFORD GLOBAL TECH LLC
2 patentsUS11713500B2Aug 1, 2023
Advanced cast aluminum alloys for automotive engine application with superior high-temperature properties
FORD GLOBAL TECH LLC0 citations57
US10752980B2Aug 25, 2020
Advanced cast aluminum alloys for automotive engine application with superior high-temperature properties
FORD GLOBAL TECH LLC0 citations47