Inventor

SONG YOUNG-HEE

KR58 patents

⚠️ This page may combine multiple inventors who share the name “SONG YOUNG-HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONG YOUNG-HEE

SAMSUNG ELECTRONICS CO LTD

Wafer level stack structure for system-in-package and method thereof

Method for manufacturing wafer level chip stack package

Semiconductor chip, chip stack package and manufacturing method

Memory card

Semiconductor chip package

Semiconductor module

Stack semiconductor chip package and lead frame

Down-bonded lead-on-chip type semiconductor device

Semiconductor package having heat spreader and package stack using the same

Semiconductor chip, chip stack package and manufacturing method

Semiconductor chip having bond pads

BGA semiconductor chip package and mounting structure thereof

Interconnection structure of integrated circuit chip

Semiconductor chip having bond pads and multi-chip package

Semiconductor package

Packing structure of semiconductor packages

Semiconductor device package having buffered memory module and method thereof

Wafer level chip scale package having a gap and method for manufacturing the same

Semiconductor chip having bond pads and multi-chip package

Wafer level stack structure for system-in-package and method thereof

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wafer level chip scale package having a gap and method for manufacturing the same

Repairable multi-chip package and high-density memory card having the package

Lead-on-chip semiconductor package and method for making the same

Wafer level stack structure for system-in-package and method thereof

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Ball grid array package stack

Light source module and illumination apparatus having the same

Illumination device

Interconnection structure of integrated circuit chip

Semiconductor multi-chip package

Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof

Dual-lead type square semiconductor package and dual in-line memory module using the same

Fabrication method of wafer level chip scale packages

Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package

YOO CHEOL-JUN

Light-emitting device package and method of manufacturing the same

Light-emitting device package and method of manufacturing the same

Light-emitting device package and method of manufacturing the light-emitting device package

SONG YOUNG HEE

Wearable smart device having flexible semiconductor package mounted on a band

Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same

MOON KYUNG-MI

Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package

Illumination apparatus employing light-emitting device package

SAMSUNG ELECTRONIC

Wafer level package having a side package

YOO CHEOL JUN

Light emitting device package and method of manufacturing the same

LEE YOUNG-JIN

Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module

LEE KANG-WOOK

Wafer level stack structure for system-in-package and method thereof

KANG SUN-WON

Semiconductor module

SHIN MU-SEOB

Semiconductor package and method of forming the same, and printed circuit board