Inventor
LIFSON MAX L
US18 patents
⚠️ This page may combine multiple inventors who share the name “LIFSON MAX L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS9324628B2Apr 26, 2016
Integrated circuit heat dissipation using nanostructures
IBM8 citations92
US10629710B2Apr 21, 2020
Integrated circuit heat dissipation using nanostructures
IBM3 citations84
US10109553B2Oct 23, 2018
Integrated circuit heat dissipation using nanostructures
IBM4 citations84
US10068827B2Sep 4, 2018
Integrated circuit heat dissipation using nanostructures
IBM5 citations84
US9601606B2Mar 21, 2017
Integrated circuit heat dissipation using nanostructures
IBM7 citations84
US10600893B2Mar 24, 2020
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US9704978B2Jul 11, 2017
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US9666701B2May 30, 2017
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US10224225B2Mar 5, 2019
Centering substrates on a chuck
IBM2 citations72
US9997385B2Jun 12, 2018
Centering substrates on a chuck
IBM2 citations72
US9685362B2Jun 20, 2017
Apparatus and method for centering substrates on a chuck
IBM3 citations72
US11152495B2Oct 19, 2021
Integrated circuit heat dissipation using nanostructures
IBM0 citations62
US11081572B2Aug 3, 2021
Integrated circuit heat dissipation using nanostructures
IBM0 citations62
US9275868B2Mar 1, 2016
Uniform roughness on backside of a wafer
IBM2 citations62
US9607929B2Mar 28, 2017
Tsv wafer with improved fracture strength
IBM0 citations48
US9312205B2Apr 12, 2016
Methods of forming a TSV wafer with improved fracture strength
IBM0 citations48