Inventor
HEPPNER JOSHUA D
US36 patents
⚠️ This page may combine multiple inventors who share the name “HEPPNER JOSHUA D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
33 patentsUS8025531B1Sep 27, 2011
Shielded socket housing
INTEL CORP29 citations92
US8905794B2Dec 9, 2014
Connector assembly and method
INTEL CORP10 citations84
US10056182B2Aug 21, 2018
Surface-mount inductor structures for forming one or more inductors with substrate traces
INTEL CORP7 citations83
US9265170B2Feb 16, 2016
Integrated circuit connectors
INTEL CORP13 citations83
US10707171B2Jul 7, 2020
Ultra small molded module integrated with die by module-on-wafer assembly
INTEL CORP5 citations82
US11955434B2Apr 9, 2024
Ultra small molded module integrated with die by module-on-wafer assembly
INTEL CORP2 citations73
US10070520B2Sep 4, 2018
Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
INTEL CORP6 citations73
US9824901B2Nov 21, 2017
Complex cavity formation in molded packaging structures
INTEL CORP2 citations73
US9385457B2Jul 5, 2016
Connector assembly and method
INTEL CORP5 citations73
US9953929B2Apr 24, 2018
Systems and methods for electromagnetic interference shielding
INTEL CORP2 citations72
US9728425B1Aug 8, 2017
Space-efficient underfilling techniques for electronic assemblies
INTEL CORP3 citations72
US9615483B2Apr 4, 2017
Techniques and configurations associated with a package load assembly
INTEL CORP3 citations72
US9953909B2Apr 24, 2018
Ball grid array (BGA) with anchoring pins
INTEL CORP2 citations70
US9780510B2Oct 3, 2017
Socket contact techniques and configurations
INTEL CORP3 citations70
US9635764B2Apr 25, 2017
Integrated circuit and method that utilize a shape memory material
INTEL CORP4 citations68
US9172160B2Oct 27, 2015
Vertical socket contact with flat force response
INTEL CORP3 citations63
US12525544B2Jan 13, 2026
Ultra small molded module integrated with die by module-on-wafer assembly
INTEL CORP0 citations62
US9385444B2Jul 5, 2016
Lateral slide pick and place cover for reduced bent pins in LGA sockets
INTEL CORP2 citations62
US8961193B2Feb 24, 2015
Chip socket including a circular contact pattern
INTEL CORP2 citations62
US10205292B2Feb 12, 2019
Socket contact techniques and configurations
INTEL CORP1 citations60
US10820437B2Oct 27, 2020
Flexible packaging for a wearable electronic device
INTEL CORP1 citations58
US10446461B2Oct 15, 2019
Complex cavity formation in molded packaging structures
INTEL CORP0 citations52
US9601848B2Mar 21, 2017
Vertical socket contact with flat force response
INTEL CORP1 citations52
US10615128B2Apr 7, 2020
Systems and methods for electromagnetic interference shielding
INTEL CORP0 citations51
US9704811B1Jul 11, 2017
Perforated conductive material for EMI shielding of semiconductor device and components
INTEL CORP0 citations51
US9603276B2Mar 21, 2017
Electronic assembly that includes a plurality of electronic packages
INTEL CORP1 citations50
US11653467B2May 16, 2023
Modular system for internet of things and method of assembling the same
INTEL CORP0 citations48
US10672625B2Jun 2, 2020
Electronic device package with recessed substrate for underfill containment
INTEL CORP0 citations48
US9795026B2Oct 17, 2017
Electronic package that includes finned vias
INTEL CORP0 citations48
US10111368B2Oct 23, 2018
Flexible substrate retention on a reusable carrier
INTEL CORP0 citations42
US9017106B2Apr 28, 2015
Connector assembly and methods with integrated pitch translation
INTEL CORP0 citations42
US10636716B2Apr 28, 2020
Through-mold structures
INTEL CORP0 citations39
US10825714B2Nov 3, 2020
Stretching retention plate for electronic assemblies
INTEL CORP0 citations29