Electronic assembly that includes a plurality of electronic packages

Abstract

Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.

What is claimed: 
     
       1. An electronic assembly comprising:
 a frame formed from a unitary piece of material; 
 a first electronic package mounted on the frame, the first electronic package including a first pin grid array; 
 a second electronic package mounted on the frame and separated laterally from the first electronic package, the second electronic package including a second pin grid array, the frame laterally surrounding the first and second electronic package; and 
 an actuation mechanism on the frame, the actuation mechanism being configured to simultaneously move the first electronic package and the second electronic package laterally relative to the frame during operation of the actuation mechanism. 
 
     
     
       2. The electronic assembly of  claim 1 , wherein the actuation mechanism is a cam mechanism. 
     
     
       3. The electronic assembly of  claim 1 , wherein the actuation mechanism is disposed laterally between the first electronic package and the second electronic package. 
     
     
       4. The electronic assembly of  claim 1 , further comprising:
 a first pin carrier mounted to the first electronic package, the first pin carrier including the first in grid array; and 
 a second pin carrier mounted to the second electronic package, the second in carrier including the second pin grid array, 
 wherein the actuation mechanism is configured to move the first pin carrier and the second pin carrier relative to the frame during operation of the actuation mechanism. 
 
     
     
       5. The electronic assembly of  claim 4 , wherein the frame surrounds the first pin carrier and the frame surrounds the second pin carrier. 
     
     
       6. The electronic assembly of  claim 4 , wherein a portion of the actuation mechanism is rotated to move the first pin carrier and the second pin carrier laterally relative to the frame during operation of the actuation mechanism. 
     
     
       7. The electronic assembly of  claim 1 , wherein the actuation mechanism is configured to move the first electronic package and the second electronic package laterally in different directions during operation of the actuation mechanism. 
     
     
       8. The electronic assembly of  claim 1 , wherein the actuation mechanism is configured to move the first electronic package and the second electronic package laterally in a same direction during operation of the actuation mechanism. 
     
     
       9. An electronic system comprising:
 an electronic assembly that includes a frame formed from a unitary piece of material and a first electronic package mounted to the frame, the first electronic package including a first pin grid array, the electronic assembly further including a second electronic package mounted to the frame and separated laterally from the first electronic package, the second electronic package including a second pin grid array, the frame laterally surrounding the first and second electronic package; and 
 a socket that includes a first receiving pin field and a second receiving pin field, the first pin receiving field including a first plurality electrical contacts and the second pin field including a second plurality electrical contacts; and 
 an actuation mechanism that is configured to simultaneously laterally engage the first pin grid array with the first plurality electrical contacts and the second pin grid array with the second plurality electrical contacts during operation of the actuation mechanism. 
 
     
     
       10. The electronic system of  claim 9 , wherein the actuation mechanism is disposed laterally between the first electronic package and the second electronic package. 
     
     
       11. The electronic system of  claim 9 , wherein the socket includes a first socket that includes the first pin receiving field and a second socket that includes the second pin receiving field. 
     
     
       12. The electronic system of  claim 9 , further comprising:
 a first pin carrier attached to the first electronic package, wherein the first pin carrier includes the first pin grid array; and 
 a second pin carrier attached to the second electronic package, wherein the second pin carrier includes the second pin grid array. 
 
     
     
       13. The electronic system of  claim 12 , wherein the first pin carrier is a same size as the second pin carrier. 
     
     
       14. The electronic system of aim  9 , wherein the socket is mounted to a substrate. 
     
     
       15. The electronic system of  claims 12 , wherein the first pin carrier and the second pin carrier move linearly in a lateral direction relative to the frame during operation of the actuation mechanism. 
     
     
       16. A method comprising:
 inserting an electronic assembly into a socket, wherein the electronic assembly includes a frame formed from a unitary piece of material, a first electronic package mounted to the frame and a second electronic package mounted to the frame and separated laterally from the first electronic package; and 
 operating an actuating mechanism that is part of the frame such that the first and second electronic packages electrically laterally engage the socket simultaneously. 
 
     
     
       17. The method of  claim 16 , wherein operating the actuating mechanism includes rotating a portion of the actuation mechanism. 
     
     
       18. The method of  claim 17 , wherein inserting an electronic assembly into a socket includes inserting a first pin grid array of the first electronic package into a first pin receiving field formed in the socket and inserting a second pin grid array of the second electronic package into a second pin receiving field formed in the socket. 
     
     
       19. The method of  claim 18 , wherein operating the actuating mechanism includes operating the actuating mechanism such that the first pin grid array laterally engages a first plurality of contacts in the first pin receiving field and the second pin grid array laterally engages a second plurality of contacts in the second pin receiving field. 
     
     
       20. The method of  claim 18 , wherein inserting the first pin grid array into the first pin receiving field includes inserting a first pin carrier that includes the first pin grid array into the first pin receiving field, wherein the first electronic package is attached to the first pin carrier, and wherein inserting the second pin grid array into the second pin receiving field includes inserting a second pin carrier that includes the second pin grid array into the second pin receiving field, wherein the second electronic package is attached to the second pin carrier. 
     
     
       21. The method of  claim 18 , wherein inserting the first pin grid array into the first pin receiving field includes inserting the first pin grid array into a first socket and inserting the second pin grid array into the second pin receiving field includes inserting the second pin grid array into a second socket. 
     
     
       22. The method of  claim 16 , further comprising removing the frame from the electronic system.